Type RMA (lower residue, non-cleaning type)
Note: See ABOUT LEAD FREE SOLDER (PbF: Pb free) ().
17.2. PROCEDURE
1. Tack the flat pack IC to the PCB by temporarily soldering two
diagonally opposite pins in the correct positions on the PCB.
2. Apply flux to all of the pins on the IC.
3. Being careful to not unsolder the tack points, slide the soldering iron
along the tips of the pins while feeding enough solder to the tip so that
it flows under the pins as they are heated.
17.3. REMOVING SOLDER FROM BETWEEN PINS
1. Add a small amount of solder to the bridged pins.
Be certain each pin is located over the correct pad on the PCB.
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