Equipotential Bonding - ABB Advant AC500 Manual

Equipotential bonding

•
Install sufficiently dimensioned equipotential bondings, if potential differences are present or have to
be expected in your application between different parts of the installation.
•
The impedance of a equipotential bonding must be equal or lower than 10 % of the shield
impedance of the shielded signal cables between the same points.
•
The conductor cross section of a equipotential bonding must be able to withstand the maximum
possible compensating current. By experience, a conductor cross section of 16 mm² has proven to
be sufficient.
•
Equipotential bondings and shielded signal cables should be laid close to each other. This prevents
coming up inductive loops in which disturbances could be induced.
•
Equipotential bondings must be connected to PE with low impedance.
AC500
24V
0V
1
3
+
24V
–
DC
2
PE
7
10
11
1 24V power supply FBP
2 Power supply for the CPU
3 Fuse for the CPU power
4 Power supply for the I/Os
5 Fuse for the I/O modules power
6 For fuses for the contacts of the relay outputs
see the descriptions of the relevant modules
Figure: AC500, equipotential bondings
____________________________________________________________________________________________________________
V2
AC500 Hardware
Cabinet 1
DC532 DX522
6
5
+
24V
–
DC
4
PE
0V
8
PE
9
only one power
supply is also
possible
1-56
S500
DC505 DC532
24V
DC
4
7
0V
PE
10
11
7 0V rail (reference potential for signals)
8 Earthing of the 0V rail
9 Cabinet earthing
10 Equipotential bonding
between the cabinets min. 16 mm
11 Cable shields earthing
System data
Cabinet 2
DX522
6
5
+
–
PE
7
8
10
9
2
AC500 / Issued: 05.2007