Board Specifications - Xilinx Zynq UltraScale+ ZCU208 User Manual

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• 20 DACIO digital I/O pins on a header strip
• 20 ADCIO digital I/O pins on a header strip
• 12V, 5V0, 3V3, VCCADJ DAC, VCCADJ_ADC, DAV_AVTT, and GND, I2C signals access on a
header strip
The XM650 balun add-on card demonstrations DAC to ADC loopback with a 16T16R
configuration of N79 baluns and filters. There is no external connectivity to the ADC or DAC
signals. Digital I/O and I2C are supported on headers.
The XM650 module features are:
• 16 DAC outputs looped back to 16 ADC inputs
• 32 N79 baluns and filters on the card
B46 or N79 band baluns can be supported with BOM change or rework by customers.
• 20 DACIO digital I/O pins on a header strip
• 20 ADCIO digital I/O pins on a header strip
• 12V, 5V0, 3V3, VCCADJ DAC, VCCADJ_ADC, DAV_AVTT, and GND access on a header strip

Board Specifications

Board Dimensions/Form Factor
When the module is mated with ZCU208 RFMC 2.0 connectors (Samtec LPAF-50-03.0-L-08-2-
K-TR), the mated height between the boards will be 4.0 mm. No component is placed on the
bottom side of the module.
UG1410 (v1.0) July 8, 2020
ZCU208 Board User Guide
Appendix C: HW-XM650/655 Balun Daughter Cards for Gen 3 RFSoC EVM
www.xilinx.com
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