Huawei MU509 Hardware Migration Manual page 6

HUAWEI 30 mm × 30 mm LGA Module
Hardware Migration Guide
3.1 Dimension Differences .................................................................................................................. 48
3.2 Customer PCB Design .................................................................................................................. 49
3.2.1 PCB Pad Design ................................................................................................................... 49
3.2.2 Requirements on PCB Layout .............................................................................................. 50
3.3 Assembly Processes ..................................................................................................................... 50
3.3.1 General Description of Assembly Processes ........................................................................ 50
3.3.2 Stencil Design ....................................................................................................................... 51
3.3.3 Reflow Profile ....................................................................................................................... 51
4 Appendix .............................................................................................................................. 53
5 Acronyms and Abbreviations............................................................................................. 69
Issue 08 (2016-12-12)
HUAWEI Proprietary and Confidential
Copyright © HUAWEI Technologies Co., Ltd.
Contents
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