Huawei MU509 Hardware Migration Manual page 52

HUAWEI 30 mm × 30 mm LGA Module
Hardware Migration Guide
Figure 3-5 Reflow profile
° C
300
240
217
180
165
120
60
0
Table 3-2 Reflow parameters
Temperature Zone
Preheat zone (40° C–
165° C)
Soak zone
(165° C–217° C)
Reflow zone (> 217° C)
Cooling zone
Issue 08 (2016-12-12)
60s~100s
Time
/
(t1–t2): 60s–100s
(t3–t4): 45s–80s
Cooling rate: 2°C/s ≤ Slope ≤ 5° C/s
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Mechanical Specifications Compatibility
235° C<Tmax<245° C
45s~80s
Key Parameter
Heating rate: 0.5° C/s–2° C/s
/
Peak reflow temperature: 235° C–
245° C
Design Guide
s
52