Vcc_Ext Interface Compatibility Design - Huawei MU509 Hardware Migration Manual

HUAWEI 30 mm × 30 mm LGA Module
Hardware Migration Guide

Surface trace in
PCB layout design
Small Pad
design
Top view of LGA and main board

2.6 VCC_EXT Interface Compatibility Design

Because the signal level of MC509 and MU509 is different from MU609, MU709,
ME209u-526, ME909u and ME909s, there are two output supplies as for reference
level. One is VCC_EXT2 (2.6 V), the other is VCC_EXT1 (1.8 V).
Table 2-13 Differences of the VCC_EXT interface
Pin Interface Name
No.
31 VCC_EXT VCC_EXT2
32 VCC_EXT1
Issue 08 (2016-12-12)
ME209u-526/ME909u-523/MU709/ME909s/MU509-65 module need to be
compatible. We recommend the RF interface design follow the design of
ME209u-526/ME909u-523/MU709/ME909s/MU509-65.
No GND Pad
We recommend the RF interface design for different modules can accord to their own

reference design.
We recommend digging the adjacent layer below the RF pad for better RF trace impedance

control.
The pin 111 and pin 115 signal trace layout can be the same as pin 107 (MAIN_ANT).

MU509 MC509
2.6 V 2.6 V
1.8 V 1.8 V
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Copyright © HUAWEI Technologies Co., Ltd.
Layer 01
Layer 02
Layer 03
A = RF pad length + 50 mils
B = RF pad width + 40 mils
MU609 ME209u ME909u
-526
N N N
1.8 V 1.8 V 1.8 V
LGA Interface Differences
RF pad reference
ground
Ground hole
MU709 ME909
s
N N
1.8 V 1.8 V
37