Huawei MU509 Hardware Migration Manual page 10

HUAWEI 30 mm × 30 mm LGA Module
Hardware Migration Guide
Table 1-2 Overview of Huawei 30 mm × 30 mm LGA modules
Product
MU509
MC509
MU609
Issue 08 (2016-12-12)
Interface
1 x USIM
1 × 8 wire UART
1 × USB (Full Speed)
2 × Microphone in
1 × Handset out
1 × Speaker out
1 × PCM
8 × GPIO
2 × LED
1 × JTAG
1 ×WAKEUP_IN
1 ×WAKEUP_OUT
1 × Antenna
1 x UIM
1 × 8 wire UART
1 × USB (Full Speed)
2 × Microphone in
1 × Handset out
1 × Speaker out
1 × PCM
7 × GPIO
2 × LED
1 × JTAG
1 × Wakeup_In
1 × Wakeup_Out
1 × W_DISABLE
3 × Antenna
1 x USIM
1 × 8 wire UART
1 × 2 wire UART (Debug)
1 × USB (High Speed)
5 × GPIO
1 × LED
1 × JTAG
1 × Wakeup_In
1 × Wakeup_Out
1 × SLEEP_STATUS
3 × Antenna
HUAWEI Proprietary and Confidential
Copyright © HUAWEI Technologies Co., Ltd.
Temperature
Normal operating
temperature: –20° C
to +70° C
Extended operating
temperature: –40° C
to +85° C
Storage
Temperature: –40° C
to +85° C
Only for MU509-
65: Normal
operating
temperature: –
30° C to +75° C
Normal operating
temperature: –20° C
to +70° C
Extended operating
temperature: –30° C
to +75° C
Storage
Temperature: –40° C
to +85° C
Normal operating
temperature: –20° C
to +70° C
Extended operating
temperature: –40° C
to +85° C
Storage
Temperature: –40° C
to +85° C
Overview
Dimension (mm)
30 × 30 × 2.6
30 × 30 × 2.65
30 × 30 × 2.27
10