Dell EMC PowerEdge MX7000 Field Service Manual page 14

Due to the increased density of semiconductors that are used in recent Dell products, the sensitivity to static damage is
now higher than in earlier Dell products. For this reason, some previously approved methods of handling parts are no longer
applicable.
There are two recognized types of ESD damage: catastrophic and intermittent failures.
● Catastrophic—The damage causes an immediate and complete loss of device functionality. For example, a memory DIMM
that has received a static shock, immediately generates a No POST/No Video symptom.
NOTE: Catastrophic failures represent approximately 20 percent of ESD-related failures.
● Intermittent—The damage weakens the component causing intermittent failure in performance. For example, if a memory
DIMM receives a static shock, the tracing weakens without producing any outward symptoms that are related to damage.
The weakened trace may take weeks or months to melt, and in the meantime may cause degradation of memory integrity
and intermittent memory errors.
NOTE: Intermittent failures represent approximately 80 percent of ESD-related failures. The high rate of intermittent
failures means that most of the time when damage occurs, it is not immediately recognizable.
Intermittent or latent failures are difficult to identify and troubleshoot. The image shows an example of damage to a memory
module trace. Although the damage is complete, the symptoms may not become an issue or cause permanent failure for some
time after the damage occurs.
Figure 8. Intermittent, latent damage to a wiring trace
To avoid an ESD damage, ensure you:
● Use a wired ESD Wrist Strap that is properly grounded.
NOTE: Wireless antistatic straps or touching the chassis is not recommended as they do not provide adequate ESD
protection.
Figure 9. Incorrect handling of components without ESD protection
● Handle all static-sensitive components in a static-safe area. If possible, use antistatic floor pads and workbench pads.
● Grasp the static-sensitive components by the side and not the top.
● Avoid touching the pins and circuit boards.
● Do not remove components from the antistatic packing material until you are ready to install the components. Before
unwrapping the antistatic packaging, be sure to discharge static electricity from your body.
14 Field service information