Motorola iDEN i930 Field Service Manual page 104

U501 (PA)
See section LGA Rework/Repair ProcedureLGA Rework/Repair Procedure
Top 330ºC - Bottom 100ºC
OK Industries15 l/min
Pace 6/7
²Use Vacuum during removal process to avoid components disturbance.
²Do not overfill pads during Land Preparation process to avoid shorts to surrounded
U300 (VCO)
See section LGA Rework/Repair ProcedureLGA Rework/Repair Procedure
Top 330ºC - Bottom 100ºC
OK Industries15 l/min
Pace 6/7
²Do not use Vacuum during removal process to avoid component disassembling.
U301 (VCO)
See section LGA Rework/Repair ProcedureLGA Rework/Repair Procedure
Top 330ºC - Bottom 100ºC
OK Industries15 l/min
Pace
²Do not use Vacuum during removal process to avoid component disassembling.
68P80401P03-O
MECHANICAL PARTS REWORK AND REPAIR: LGA REWORK/REPAIR PROCEDURE
components.
²Remove solder balls when observed after reflow.
6/7
N-Q07
"R" over J001/J002 will
prevent degradation.
NOTE
N-Q07
"L" over J800 will prevent
degradation.
NOTE
N-Q07
None
NOTE
9-7