Table 29-1. Surface Mounting Type Soldering Conditions (2/2)
µ
PD78F0114M1GB-8ES, 78F0114M2GB-8ES, 78F0114M3GB-8ES, 78F0114M4GB-8ES, 78F0114M5GB-8ES,
µ
PD
78F0114M6GB-8ES, 78F0114M1GB(A)-8ES, 78F0114M2GB(A)-8ES, 78F0114M3GB(A)-8ES,
µ
PD
78F0114M4GB(A)-8ES, 78F0114M5GB(A)-8ES, 78F0114M6GB(A)-8ES, 78F0114M1GB(A1)-8ES,
µ
PD
78F0114M2GB(A1)-8ES, 78F0114M5GB(A1)-8ES, 78F0114M6GB(A1)-8ES
Soldering Method
Infrared reflow
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Twice or less, Exposure limit: 3 days
hours)
VPS
Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher),
Count: Twice or less, Exposure limit: 3 days
hours)
Wave soldering
Solder bath temperature: 260°C max., Time: 10 seconds max., Count: Once,
Preheating temperature: 120°C max. (package surface temperature), Exposure
limit: 3 days
Partial heating
Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
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CHAPTER 29 RECOMMENDED SOLDERING CONDITIONS
Soldering Conditions
Note
(after that, prebake at 125°C for 10 hours)
User's Manual U16227EJ2V0UD
Note
(after that, prebake at 125°C for 10
Note
(after that, prebake at 125°C for 10
Recommended
Condition Symbol
IR35-103-2
VP15-103-2
WS60-103-1
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