Chapter 29 Recommended Soldering Conditions - NEC 78K0 User Manual

CHAPTER 29 RECOMMENDED SOLDERING CONDITIONS

These products should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, please contact an NEC Electronics
sales representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Table 29-1. Surface Mounting Type Soldering Conditions (1/2)
µ
PD780111GB-×××-8ES, 780112GB-×××-8ES, 780113GB-×××-8ES, 780114GB-×××-8ES,
µ
PD780111GB(A)-×××-8ES, 780112GB(A)-×××-8ES, 780113GB(A)-×××-8ES, 780114GB(A)-×××-8ES,
µ
PD780111GB(A1)-×××-8ES, 780112GB(A1)-×××-8ES, 780113GB(A1)-×××-8ES, 780114GB(A1)-×××-8ES,
µ
PD780111GB(A2)-×××-8ES, 780112GB(A2)-×××-8ES, 780113GB(A2)-×××-8ES, 780114GB(A2)-×××-8ES
Soldering Method
Infrared reflow Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Twice or less, Exposure limit: 7 days
hours)
VPS Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher),
Count: Twice or less, Exposure limit: 7 days
hours)
Wave soldering Solder bath temperature: 260°C max., Time: 10 seconds max., Count: Once,
Preheating temperature: 120°C max. (package surface temperature), Exposure
limit: 7 days
Partial heating Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
Soldering Conditions
Note
(after that, prebake at 125°C for 10 hours)
User's Manual U16227EJ2V0UD
Note
(after that, prebake at 125°C for 10
Note
(after that, prebake at 125°C for 10
Recommended
Condition Symbol
IR35-107-2
VP15-107-2
WS60-107-1
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