Sony HXC-100 Service Manual page 63
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Also See for HXC-100:
- Operating instructions manual (149 pages) ,
- Service manual (130 pages) ,
- Operating instructions manual (44 pages)
Table of Contents
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SY-363 BOARD
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Ref. No.
or Q'ty Part No.
SP Description
1pc
A-1707-921-A s MOUNTED CIRCUIT BOARD, SY-363
3pcs
3-729-061-02 s SCREW (M2) (TYPE 1)
BT101
1-756-076-21 s HOLDER, LITHIUM BATTERY
C1
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C2
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C3
1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C4
1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225
C5
1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225
C8
1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C9
1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C11
1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C12
1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C13
1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C14
1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225
C15
1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225
C16
1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225
C18
1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C19
1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C20
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C21
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C22
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C23
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C24
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C25
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C28
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C30
1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C31
1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225
C32
1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225
C33
1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225
C34
1-112-692-81 s CAP,CHIP CERAMIC1000PF CH 1005
C36
1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C37
1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C38
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C42
1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225
C43
1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C45
1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225
C46
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C47
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C48
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C49
1-126-400-21 s CAP, CHIP ELECT 22MF(6.3X5.7)
C50
1-126-400-21 s CAP, CHIP ELECT 22MF(6.3X5.7)
C51
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C52
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C53
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C107
1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C109
1-164-858-81 s CAP, CHIP CERAMIC 22PF CH 1005
C110
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C111
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C112
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C113
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C114
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C115
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C116
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C117
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C118
1-114-999-11 s CAP, DOUBLE LAYERS 0.22F
C119
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C120
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C121
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
HXC-100/V2 (J, E)
(SY-363 BOARD)
Ref. No.
or Q'ty Part No.
SP Description
C122
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C123
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C124
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C125
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C126
1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C127
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C128
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C129
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C130
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C131
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C132
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C133
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C134
1-164-935-81 s CAP, CHIP CERAMIC 470PF B 1005
C135
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C136
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C137
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C138
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C139
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C140
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C141
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C142
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C143
1-119-923-81 s CAP, CERAMIC 0.047MF B 1005
C144
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C145
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C146
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C147
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C148
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C149
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C150
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C151
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C152
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C153
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C154
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C155
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C156
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C157
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C158
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C159
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C160
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C161
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C162
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C163
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C164
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C165
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C166
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C167
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C168
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C169
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C170
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C171
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C172
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C173
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C175
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C176
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C180
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C181
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C182
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C183
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C184
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
1-55
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