Sony HXC-100 Service Manual page 36
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Also See for HXC-100:
- Operating instructions manual (149 pages) ,
- Service manual (130 pages) ,
- Operating instructions manual (44 pages)
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(DPR-298 BOARD)
Ref. No.
or Q'ty Part No.
SP Description
C113
1-164-866-81 s CAP, CHIP CERAMIC 47PF CH 1005
C114
1-164-850-81 s CAP, CHIP CERAMIC 10PF CH 1005
C115
1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C116
1-165-875-91 s CAP, CHIP CERAMIC 10MF B 3216
C118
1-165-875-91 s CAP, CHIP CERAMIC 10MF B 3216
C119
1-165-875-91 s CAP, CHIP CERAMIC 10MF B 3216
C120
1-165-875-91 s CAP, CHIP CERAMIC 10MF B 3216
C122
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C123
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C124
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C125
1-164-936-81 s CAP, CHIP CERAMIC 680PF B 1005
C126
1-164-936-81 s CAP, CHIP CERAMIC 680PF B 1005
C127
1-164-936-81 s CAP, CHIP CERAMIC 680PF B 1005
C128
1-165-875-91 s CAP, CHIP CERAMIC 10MF B 3216
C129
1-165-875-91 s CAP, CHIP CERAMIC 10MF B 3216
C130
1-165-875-91 s CAP, CHIP CERAMIC 10MF B 3216
C131
1-100-881-91 s CAP, CERAMIC 47MF C (3216)
C132
1-100-881-91 s CAP, CERAMIC 47MF C (3216)
C133
1-100-881-91 s CAP, CERAMIC 47MF C (3216)
C135
1-100-881-91 s CAP, CERAMIC 47MF C (3216)
C137
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C138
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C139
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C140
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C141
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C142
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C143
1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C144
1-114-548-11 s CAP, NIOBIUM ELECT 22UF
C145
1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C146
1-114-548-11 s CAP, NIOBIUM ELECT 22UF
C147
1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C148
1-114-548-11 s CAP, NIOBIUM ELECT 22UF
C149
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C150
1-114-548-11 s CAP, NIOBIUM ELECT 22UF
C151
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C154
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C162
1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C163
1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C164
1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C166
1-114-548-11 s CAP, NIOBIUM ELECT 22UF
C170
1-114-214-81 s CAP,CHIP CERAMIC470PF CH1005
C171
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C172
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C173
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C174
1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C175
1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C176
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C177
1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C178
1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C181
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C182
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C183
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C184
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C185
1-164-850-81 s CAP, CHIP CERAMIC 10PF CH 1005
C186
1-164-850-81 s CAP, CHIP CERAMIC 10PF CH 1005
C187
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C188
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C189
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C190
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
1-28
(DPR-298 BOARD)
Ref. No.
or Q'ty Part No.
SP Description
C191
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C192
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C193
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C194
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C195
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C196
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C197
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C198
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C199
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C201
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C202
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C203
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C204
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C205
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C206
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C207
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C208
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C209
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C210
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C211
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C212
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C213
1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C214
1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C215
1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C216
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C217
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C218
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C219
1-164-845-81 s CAP, CHIP CERAMIC 5PF CH 1005
C220
1-164-845-81 s CAP, CHIP CERAMIC 5PF CH 1005
C221
1-164-845-81 s CAP, CHIP CERAMIC 5PF CH 1005
C222
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C223
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C224
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C225
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C226
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C227
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C228
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C229
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C230
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C231
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C232
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C233
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C234
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C235
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C236
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C237
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C238
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C239
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C240
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C241
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C242
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C243
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C244
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C245
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C246
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C247
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C248
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C249
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C250
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
HXC-100/V2 (J, E)
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