Sony HXC-100 Service Manual page 38

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(DPR-298 BOARD)
Ref. No.
or Q'ty Part No.
SP Description
C577
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C578
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C579
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C580
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C581
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C582
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C583
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C584
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C585
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C586
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C587
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C588
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C589
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C590
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C591
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C592
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C593
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C594
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C595
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C596
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C597
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C598
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C599
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C600
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C601
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C602
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C603
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C604
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C605
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C606
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C607
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C608
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C609
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C610
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C611
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C612
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C613
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C614
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C615
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C616
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C617
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C618
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C619
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C620
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C621
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C622
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C623
1-127-956-21 s CAP, CHIP FILM 0.1MF (3225)
C624
1-127-956-21 s CAP, CHIP FILM 0.1MF (3225)
C625
1-114-549-11 s CAP, NIOBIUM ELECT 47UF
C626
1-114-548-11 s CAP, NIOBIUM ELECT 22UF
C627
1-114-549-11 s CAP, NIOBIUM ELECT 47UF
C629
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C630
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C631
1-127-956-21 s CAP, CHIP FILM 0.1MF (3225)
C632
1-127-956-21 s CAP, CHIP FILM 0.1MF (3225)
C633
1-127-950-21 s CAP, CHIP FILM 0.01MF (2012)
C634
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C635
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C636
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
1-30
(DPR-298 BOARD)
Ref. No.
or Q'ty Part No.
SP Description
C637
1-127-950-21 s CAP, CHIP FILM 0.01MF (2012)
C638
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C639
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C640
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C641
1-164-850-81 s CAP, CHIP CERAMIC 10PF CH 1005
C642
1-164-850-81 s CAP, CHIP CERAMIC 10PF CH 1005
C643
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C644
1-164-850-81 s CAP, CHIP CERAMIC 10PF CH 1005
C645
1-164-850-81 s CAP, CHIP CERAMIC 10PF CH 1005
C646
1-164-850-81 s CAP, CHIP CERAMIC 10PF CH 1005
C647
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C648
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C649
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C650
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C656
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C657
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C658
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C659
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C660
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C661
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C662
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C663
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C664
1-112-300-91 s CAP, CERAMIC 4.7MF B (2012)
C665
1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C666
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C667
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C668
1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C669
1-100-881-91 s CAP, CERAMIC 47MF C (3216)
C670
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C671
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C672
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C673
1-100-881-91 s CAP, CERAMIC 47MF C (3216)
C674
1-164-850-81 s CAP, CHIP CERAMIC 10PF CH 1005
C675
1-164-850-81 s CAP, CHIP CERAMIC 10PF CH 1005
C701
1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C702
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C731
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C732
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C733
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C734
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C735
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C736
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C737
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C738
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C739
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C740
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C741
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C742
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C743
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C744
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C745
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C746
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C747
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C748
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C749
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C750
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C751
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C752
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C753
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
HXC-100/V2 (J, E)

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