Sony HXC-100 Service Manual page 56
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Also See for HXC-100:
- Operating instructions manual (149 pages) ,
- Service manual (130 pages) ,
- Operating instructions manual (41 pages)
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MS-91 BOARD
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Ref. No.
or Q'ty Part No.
SP Description
1pc
A-1708-080-A s MOUNTED CIRCUIT BOARD, MS-91
C1
1-135-960-91 s CAP, CHIP CERAMIC 10MF B(3225)
C2
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C3
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C4
1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C5
1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C6
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C7
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C8
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C9
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C10
1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C11
1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C12
1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C19
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C20
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
CN1
1-816-113-21 s CONNECTOR 15P
CN2
1-778-965-21 s CONNECTOR 12P
CN3
1-793-152-21 o CONNECTOR 11P
CN4
1-817-653-42 s MEMORY STICK CONNECTOR
CN5
1-816-562-31 s CONNECTOR, FFC/FPC(ZIF) ST 36P
CN6
1-785-946-21 s CONNECTOR 3P
D3
8-719-989-04 s DIODE DAN222-TL
D4
6-500-122-01 s DIODE CL-375HR/YG-D-TS
FB1
1-400-832-21 s SMD EMI FERRITE
FB2
1-400-832-21 s SMD EMI FERRITE
IC1
6-712-297-01 s IC PCA9555DBR
IC2
6-712-297-01 s IC PCA9555DBR
IC3
6-711-237-01 s IC NJM2878F3-33 (TE2)
IC4
6-706-476-01 s IC TC7SET04FU(T5RSOJF)
IC5
6-706-476-01 s IC TC7SET04FU(T5RSOJF)
IC6
6-711-116-01 s IC NJM2878F3-05 (TE2)
Q3
8-729-928-91 s TRANSISTOR DTC114EE-TL
Q4
8-729-928-91 s TRANSISTOR DTC114EE-TL
R1
1-208-887-81 s RES, CHIP 1.0K (1005)
R2
1-208-887-81 s RES, CHIP 1.0K (1005)
R3
1-208-879-81 s RES, CHIP 470 (1005)
R4
1-208-879-81 s RES, CHIP 470 (1005)
R5
1-208-855-81 s RES, CHIP 47 (1005)
R6
1-208-855-81 s RES, CHIP 47 (1005)
R7
1-208-887-81 s RES, CHIP 1.0K (1005)
R8
1-208-887-81 s RES, CHIP 1.0K (1005)
R10
1-208-855-81 s RES, CHIP 47 (1005)
R11
1-208-855-81 s RES, CHIP 47 (1005)
R12
1-208-887-81 s RES, CHIP 1.0K (1005)
RB7
1-234-370-21 s RES, NETWORK 22 (1005X4)
RB8
1-234-370-21 s RES, NETWORK 22 (1005X4)
1-48
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NR-80 BOARD
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Ref. No.
or Q'ty Part No.
SP Description
1pc
A-1708-086-A s MOUNTED CIRCUIT BOARD, NR-80
C4
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C5
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C8
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C9
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C10
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C11
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C12
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C13
1-114-548-11 s CAP, NIOBIUM ELECT 22UF
C14
1-114-548-11 s CAP, NIOBIUM ELECT 22UF
C15
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C16
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C17
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C18
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C19
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C20
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C21
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C22
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C23
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C24
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C25
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C26
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C27
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C28
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C29
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C30
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C31
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C32
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C33
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C34
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C35
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C36
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C37
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C38
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C39
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C40
1-114-548-11 s CAP, NIOBIUM ELECT 22UF
C41
1-114-548-11 s CAP, NIOBIUM ELECT 22UF
C49
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C50
1-165-884-91 s CAP, CERAMIC 2.2MF (1608)
C51
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C52
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C53
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C54
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C55
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C56
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C57
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C58
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C59
1-114-548-11 s CAP, NIOBIUM ELECT 22UF
C60
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C61
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C62
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C63
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C64
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C65
1-164-858-81 s CAP, CHIP CERAMIC 22PF CH 1005
C68
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C69
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C70
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C71
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
HXC-100/V2 (J, E)
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