Toshiba GR200 Series Instruction Manual page 281

Centralized busbar protection ied

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Signal processing and communication modules (CPU)

Signal-processing and communication module (CPU), for the 'Max dual ports' of MainUnit, is

made up of a main circuit board for processing (CP1M) and 'piggyback' circuit boards for

communication modules (COM). These circuit boards are used for LAN, time synchronization

and others. The circuit boards are mounted on CPU and are provided with connectors on their

printed circuit board (PCB).

Microprocessor

CPU for the Max. dual ports

Figure 4.3-1 CPU structure for the Max. Dual Ports

Relay operations, controlling etc. are achieved with microprocessor on the CP1M. It has

SDRAM, MRAM, and NOR-Flash. The NOR-Flash is used to store setting data and recording

data; the MRAM is used to store several counter values. Both are of non-volatile memory so

that the stored data will be not be erased if the power is cut off.

Another layout is Figure 4.3-2 designed for the 'Dual ports with LAN for Local PC': MainUnit

has five COMs on CPU and OPT2 module on PCX to perform upstream communication.

SubUnit has OPT2 module on CPU operating only for the Main–SubUnit communication.

Microprocessor

CPU for the Dual ports with LAN for Local PC

Figure 4.3-2 CPU structure for the Dual Ports with LAN for Local PC

Regarding with the 'Stand-alone' type of MainUnit, the CPU can have five COMs. It does not

include OPT2 module.

6F2S1931 (0.20)

Centralized GRB200

(Soft: 030, 031, 032, 033, 034)

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