Canon Die Bonder BESTEM-D01 Manual page 34

BESTEM – D01R
Setting procedure for DBI-chip inspection parameter setting tab.
Description on the tab items. Set according to the following step.
1) Normal user Island Base tab items
・In normal user Island base tab, set the image region with
Image region setting tab.
［Setting step］
① Transfer frame with chip already mounted to mount
position.
②When chip is clearly shown, use Image region setting to
align chip center to image center. Please set up the image
region so that the template center set up by island
recognition edit is the image display center. Setting should
be carried out with chip already mounted on the island.
・In DBI-Island base parameter setting, set the chip size in ④.
［Setting step］
①With Setting button, Check the chip image and carry out
chip size teaching.
・In DBI-Island base parameter setting, input the chip
thickness in ⑤.［unit：μm］
※Other items are same as island recognition island base setting.
If modification is required, please follow island recognition base
setting procedure.
2) Super user Island Base tab
・In Super User island base tab, please set the DBI-Island REC
execute SW.
［Setting step］
In DBI recognition, if re-execute of island recognition is
necessary, then set it to "ON", else set it to "OFF".
・In Super User Island Base tab, please set the exposure time.
［Setting step］
Set the exposure time so that chip mounted is clearly shown,
In case DBI-Island REC is set to "OFF", the exposure is set
such that island image is not visible, as long as the chip is
clearly shown, inspection is possible.
※Other items are same as island recognition island base setting.
If modification is required, please follow island recognition base
setting procedure.
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