Dbi/Chip Inspection - Canon Die Bonder BESTEM-D01 Manual

BESTEM – D01R
6. DBI／Chip Inspection
When DBI/Chip inspection button in recognition main screen is clicked, the following screen will be
displayed and DBI/chip inspection teaching can be done. Set according to ①～③ procedure. Basic screen
and basic operation is as in chip recognition setting.
⑤
④
④
②
②
①
DBI-Chip inspection parameter setting tab
(Item: Island Base , Island Template , chip template , AgP spread
* The contents of each item change by the change of Normal user/Super user.
[Setting step] Each item setting procedure will be elaborate from next page.
②
SuperUser button
With SuperUser button, DBI-chip inspection parameter setting tab can be change between Normal user and
super user. ※When DBI－chip inspection setting tab is at super user, the button name will change from
SuperUser to NormalUser .
③
Apply button
Saves DBI/chip inspection parameter. If Return is clicked without clicking Apply first, setting will
return to previously saved setting.
④
REC exe button
Carry out chip inspection trace position. Check if parameters are correct.
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⑥
⑦
①
)
③
③
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