RM-750
System Module
SIM interface
The phone has a SIM (Subscriber Identification Module) interface including a SIM connector.
The SIM interface consists of an internal interface between RAPU and EM ASIC (N2200), and an external
interface between EM ASIC and SIM contacts.
The SIM interface supports both 1.8V and 3.0V SIM cards. The SIM interface voltage is first 1.8 V when the SIM
card is inserted, and if the card does not response to the ATR (Answer to Request), 3V interface voltage is
used.
Device memory
The memory components of the device are internal COMBO POP4 2Gb DDR + 4Gb M3 (NAND) and a card reader
for MicroSD.
The MicroSD is used as a user's data storage memory. The µSD card is connected to RAPU via EM ASIC which
has an internal level shifter with an ESD protection filter.
Bluetooth interface
Bluetooth provides a fully digital link for communication between a master unit (the phone) and one or more
slave units (e.g. a wireless headset). Data and control interface for a low power RF module is provided by the
BTHFM module.
Bluetooth is physically integrated with FM radio in the BTHFM module ASIC, but from a functional point of
view they have nothing in common
Issue 1
Figure 20 SIM interface
COMPANY CONFIDENTIAL
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