Huawei MU709 Series Hardware Manual page 42

HUAWEI MU709 Series HSPA+ Mini PCIe Module
Hardware Guide
Item
Thermal shock
Salty fog test
Sine vibration
Shock test
Issue 04 (2015-06-25)
Test Condition
 Low temperature:
–40ºC
 High temperature:
85ºC

Temperature change
interval: < 20s
 Operation mode: no
power
 Test duration: 100
cycles; 15 Min+15
Min/cycle
 Temperature: 35°C

Density of the NaCl
solution: 5%±1%
 Operation mode: no
power, no package
 Test duration:
Spraying interval: 8 h
Exposing period after
removing the salty fog
environment: 16 h
 Frequency range: 5 Hz
to 200 Hz

Acceleration: 1 Grms
 Frequency scan rate:
0.5oct/min

Operation mode:
working with service
connected

Test duration: 3 axial
directions. 2 h for each
axial direction

Half-sine wave shock
 Peak acceleration: 30
Grms

Shock duration: 11 ms
 Operation mode:
working with service
connected
 Test duration: 6 axial
directions. 3 shocks
for each axial
direction.
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
Electrical and Reliability Features
Standard Sample size
JESD22- 3 pcs/group
A106-B
JESD22- 3 pcs/group
A107-B
JESD22- 3 pcs/group
B103-B
JESD-B1 3 pcs/group
04-C
Results
Visual inspection: ok
Function test: ok
RF specification: ok
Visual inspection: ok
Function test: ok
RF specification: ok
Visual inspection: ok
Function test: ok
RF specification: ok
Visual inspection: ok
Function test: ok
RF specification: ok
42