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Chapter
OUTLINE OF EQUIPMENT
OUTLINE OF EQUIPMENT
BD30S-M
BD30S-M is the device carrying out the high-speed bond dispensing for setting chip.
Lightening the movable part and specifying the small vibration achieved the super
high-speed dispensing of 0.08 seconds per a shot. At the same time, dispensing
accuracy is improved as high as ± 0.1 mm. It has the dispensing recognition feed-
back function, and the best dispensing for the bond to use is available. Also, as it is
handy to change syringes for changing machines.
Also making the data creation off-line greatly contributes to improve the ratio of run-
ning machine, and the LCD color touch panel makes it easy to watch the display and
operate.
BD30S-M
293C-E-EMA01-A01-01
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