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Epson Manuals
Computer Hardware
0C88832
Technical manual
Epson 0C88832 Technical Manual page 152
Cmos 8-bit single chip microcomputer
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9 PAD LAYOUT
E0C88862
30
35
40
45
50
55
Die No.
146
25
20
60
65
5.85 mm
15
10
Y
X
(0, 0)
70
75
EPSON
5
1
115
110
105
100
95
90
80
85
Chip thickness: 0.4 mm
Pad opening:
E0C88832/88862 TECHNICAL MANUAL
100 µm
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