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華
碩
電
腦
華
碩
電
腦
f. The next process returns to calibration and pretest after the defect
component is found out and reworked.
PCS 1900 Tx debug
a. Spectrum analyzer connects with a high impedance probe. Execute GSM
debug tool and set parameters in the above table.
b. Use the high impedance probe to sequentially measure RF power of test
points on GSM Tx path, including antenna pad, L59, C228, and C917.
Corresponding locations are shown in "4. RF Tx/Rx Path and Test Points."
Furthermore, measurement error of RF power on each test point is unavoidable
due to measurement skills and methods of using high impedance probe. After
probing sequential test points, the probable defect component should be
checked that DC power is supplied for this component at proper voltage level.
c. Antenna pad: all components on Tx path are good if power is measured
from antenna pad within 25dBm~32dBm. In this case, engineers shall go to
next debug process, general GSM Rx debug.
TSD ■ Lv3Lv4 Repair Manual
67
ASUS Proprietary
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