Toshiba MCY-MUG0401HSW-E Service Manual page 241

(11) Install the cover, turn on the power, and check operation.
IPDU P.C.board
① Single-touch spacer
② Screw
(M4×14)
P.C.board
First remove the
Screws ② , and then
remove the P.C.
board assembly.
④ Screw(M4×8)
Used to secure the lead wire
Screw tightening torque: 1.2 ±0.1 N•m
⑤ Screw(M3×14)
Used to secure the IGBT, IPM and rectifiers
Screw tightening torque: 0.55 ±0.1 N•m
③
Card spacer
Push this in the direction of the arrow to
unlock and remove the P.C. board
assembly.
P.C.board
Reactor
Reactor
Evenly apply the silicon heat sink compound to the heat-sink surfaces of the
IPM, IGBT and rectifier devices.
Caution: It must be ensured that no dust, etc. adheres to the heat-sink
surfaces of the IPM, IGBT and rectifier devices.
Standard for heat silicone heat sink compound:
Manufacturer: Shin-Etsu Chemical Co., Ltd.
Type: G746 or G747
240
Caution: Wiring not to touch the
Reactor core.
③ Card spacer
④ Screw(M4×8)
Used to secure the lead wire
Screw tightening torque: 1.2 ±0.1 N•m
⑤ Screw(M3×14)
Used to secure the rectifiers
Screw tightening torque: 0.55 ±0.1 N•m
④
Screw(M4×8)
Used to secure the lead wire
Screw tightening torque: 1.2 ±0.1 N•m
⑥
Screw(M4×15)
Used to secure the IPM
Screw tightening torque: 1.2 ±0.1 N•m
① Single-touch spacer
② Screw(M4×14)