Soldering Guidelines - Honeywell SOMAT39 User Manual

Soldering Guidelines

SOMAT39 is compatible with industrial standard reflow profile for Pb-free solders. The
reflow profile selection to be done based on the thermal mass of the entire populated
PCB, heat transfer efficiency of the oven and solder paste used.
I. Refer to technical documentations of solder paste for profile
configurations.
II. Avoid using more than one reflow cycle.
III. Aperture size of the stencil should be 1:1 with the pad size.
IV. For further recommendation, please refer to the JEDEC/IPC J-STD-020,
IPC-SM-782 and IPC 7351 guidelines.
Below is the overview of recommended Re-flow:
(1) Solder paste alloy: SAC305 (Sn96.5/Ag3.0/Cu0.5) (Lead Free solder paste.)
(2) A-B. Temp.: 150~200℃; soak time:60~120sec. (Base on Flux type, reference only)
(3) C. Peak temp: <245℃
(4) D. Time above 217 ℃: 40~90sec. (Base on SAC305)
(5) Suggestion: Optimal cooling rate is <1℃/sec. from peak to 217 ℃.
(6) Nine heater zones at least for Reflow equipment.
(7) Nitrogen usage is recommended and be controlled the value less than 1500 ppm.
Note: Need to inspect solder joint by X-ray post reflow
14