Related Manuals for Lanner LEC-7233 Series
Summary of Contents for Lanner LEC-7233 Series
- Page 1 Embedded Computing Platform LEC‐7233 Series Embedded Computing Platform User Manual Rev 1.0 Date: August 8, 2016 ...
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Page 2: Revision History
Revision Date Description 0.1 July 12, 2016 Preliminary 1.0 August 8, 2016 Official release This document contains proprietary information of Lanner Electronics Inc. –and is not to be disclosed or used except in accordance with applicable agreements. Copyright © 2016. All Rights Reserved. Copyright© 2016 Lanner Electronics Inc. All rights reserved. The information in this document is proprietary and confidential to Lanner Electronics Inc. No part of this document may be reproduced in any form or by any means or used to make any derivative work (such as translation, transformation, or adaptation) without the express written consent of Lanner Electronics Inc. Lanner Electronics Inc. reserves the right to revise this document and to make changes in content from time to time without obligation on the part of Lanner Electronics Inc. to provide notification of such revision or change. The information in this document is furnished for informational use only, is subject to change without notice, and should not be construed as a commitment by Lanner Electronics Inc. Lanner Electronics Inc. assumes no responsibility or liability for any errors or inaccuracies that may appear in this document or any software that may be provided in association with this document. ... - Page 3 Embedded Computing Platform Online Resources The listed websites are links to the on‐line product information and technical support. Resource Website Lanner www.lannerinc.com Product Resources www.lannerinc.com/support/download‐center RMA http://eRMA.lannerinc.com Acknowledgement Intel®, Pentium and Celeron are registered trademarks of Intel® Corp. Microsoft Windows and MS‐DOS are registered trademarks of Microsoft Corp. All other product names or trademarks are properties of their respective owners. Compliances and Certification CE Certification This product has passed the CE test for environmental specifications. Test conditions for passing included the equipment being operated within an industrial enclosure. In order to protect the product from being damaged by ESD (Electrostatic Discharge) and EMI leakage, we strongly recommend the use of CE‐compliant industrial enclosure products. FCC Class A Certification This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense. EMC Notice This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case users will be required ...
- Page 4 Embedded Computing Platform to correct the interference at their own expense. Safety Guidelines Follow these guidelines to ensure general safety: Keep the chassis area clear and dust‐free before, during and after installation. Do not wear loose clothing or jewelry that could get caught in the chassis. Fasten your tie or scarf and roll up your sleeves. Wear safety glasses/goggles if you are working under any conditions that might be hazardous to your eyes. Do not perform any action that creates a potential hazard to people or makes the equipment unsafe. Disconnect all power by turning off the power and unplugging the power cord before installing or removing a chassis or working near power supplies Do not work alone if potentially hazardous conditions exist. Never assume that power is disconnected from a circuit; always check the circuit. LITHIUM BATTERY CAUTION: Risk of explosion could occur if battery is replaced by an incorrect type. Please dispose of used batteries according to the recycling instructions of your country. Operating Safety Electrical equipment generates heat. Ambient air temperature may not be adequate to cool equipment to acceptable operating temperatures without adequate circulation. Be sure that the room in which you choose to operate your system has adequate air circulation. Ensure that the chassis cover is secure. The chassis design allows cooling air to circulate effectively. An open chassis permits air leaks, which may interrupt and redirect the flow of cooling air from internal components. Electrostatic discharge (ESD) can damage equipment and impair electrical circuitry. ESD damage occurs when electronic components are improperly handled and can result in complete or intermittent failures. Be sure to follow ESD‐prevention procedures when removing and replacing components to avoid these problems. Wear an ESD‐preventive wrist strap, ensuring that it makes good skin contact. If no wrist strap is available, ground yourself by touching the metal part of the chassis. Periodically check the resistance value of the antistatic strap, which should be between 1 and 10 megohms (Mohms). Installation only by a trained electrician or only by an electrically trained person who knows all the applied or related installation and device specifications.. Do not carry the handle of power supplies when moving to other place. ...
- Page 5 Embedded Computing Platform The machine can only be used in a fixed location such as labs or computer facilities. Mounting Installation Environment Precaution 1. Elevated Operating Ambient ‐ If installed in a closed or multi‐unit rack assembly, the operating ambient temperature of the rack environment may be greater than room ambient. Therefore, consideration should be given to installing the equipment in an environment compatible with the maximum ambient temperature (Tma) specified by the manufacturer. 2. Reduced Air Flow ‐ Installation of the equipment in a rack should be such that the amount of air flow required for safe operation of the equipment is not compromised. 3. Mechanical Loading ‐ Mounting of the equipment in the rack should be such that a hazardous condition is not achieved due to uneven mechanical loading. 4. Circuit Overloading ‐ Consideration should be given to the connection of the equipment to the supply circuit and the effect that overloading of the circuits might have on over‐current protection and supply wiring. Appropriate consideration of equipment nameplate ratings should be used when addressing this concern. 5. Reliable Earthing ‐ Reliable earthing of rack‐mounted equipment should be maintained. Particular attention should be given to supply connections other than direct connections to the branch circuit (e.g. use of power strips).” Consignes de sécurité Suivez ces consignes pour assurer la securite generale : Laissez la zone du chassis propre et sans poussiere pendant et apres l’installation. Ne portez pas de vetements amples ou de bijoux qui pourraient etre pris dans le chassis. Attachez votre cravate ou echarpe et remontez vos manches. Portez des lunettes de securite pour proteger vosmyeux. N’effectuez aucune action qui pourrait creer un dangermpour d’autres ou rendre l’equipement dangereux. Coupez completement l’alimentation en eteignant l’alimentation et en debranchant le cordon d’alimentation avant d’installer ou de retirer un chassis ou de travailler a proximite de sources d’alimentation. Ne travaillez pas seul si des conditions dangereuses sont presentes. Ne considerez jamais que l’alimentation est coupee d’un circuit, verifiez toujours le circuit. Cet appareil genere, utilise et emet une energie radiofrequence et, s’il n’est pas installe et utilise conformement aux instructions des fournisseurs de composants sans fil, il risque de provoquer des interferences dans les communications radio. ...
- Page 6 Embedded Computing Platform Avertissement concernant la pile au lithium Risque d’explosion si la pile est remplacee par une autre d’un mauvais type. Jetez les piles usagees conformement aux instructions. L’installation doit etre effectuee par un electricien forme ou une personne formee a l’electricite connaissant toutes les specifications d’installation et d’appareil du produit. Ne transportez pas l’unite en la tenant par le cable d’alimentation lorsque vous deplacez l’appareil. La machine ne peut etre utilisee qu’a un lieu fixe comme en laboratoire, salle d’ordinateurs ou salle de classe. Sécurité de fonctionnement L’equipement electrique genere de la chaleur. La temperature ambiante peut ne pas etre adequate pour refroidir l’equipement a une temperature de fonctionnement acceptable sans circulation adaptee. Verifiez que votre site propose une circulation d’air adequate. Verifiez que le couvercle du chassis est bien fixe. La conception du chassis permet a l’air de refroidissement de bien circuler. Un chassis ouvert laisse l’air s’echapper, ce qui peut interrompre et rediriger le flux d’air frais destine aux composants internes. Les decharges electrostatiques (ESD) peuvent endommager l’equipement et gener les circuits electriques. Des degats d’ESD surviennent lorsque des composants electroniques sont mal manipules et peuvent causer des pannes totales ou intermittentes. Suivez les procedures de prevention d’ESD lors du retrait et du remplacement de composants. ‐ Portez un bracelet anti‐ESD et veillez a ce qu’il soit bien au contact de la peau. Si aucun bracelet n’est disponible, reliez votre corps a la terre en touchant la partie metallique du chassis. Verifiez regulierement la valeur de resistance du bracelet antistatique, qui doit etre comprise entre 1 et 10 megohms (Mohms). Consignes de sécurité électrique Avant d’allumer l’appareil, reliez le cable de mise a la terre de l’equipement a la terre. Une bonne mise a la terre (connexion a la terre) est tres importante pour proteger l equipement contre les effets nefastes du bruit externe et reduire les risques d’electrocution en cas de foudre. Pour desinstaller l’equipement, debranchez le cable de mise a la terre apres avoir eteint l’appareil. Un cable de mise a la terre est requis et la zone reliant les sections du conducteur doit faire plus de 4 mm2 ou 10 AWG. Procédure de mise à la terre pour source d’alimentation CC Procédure de mise à la terre pour source d’alimentation CC • Desserrez la vis du terminal de mise a la terre. • Branchez le cable de mise a la terre a la terre. ...
- Page 7 Embedded Computing Platform • L’appareil de protection pour la source d’alimentation CC doit fournir 30 A de courant. Cet appareil de protection doit etre branche a la source d’alimentation avant l’alimentation CC. ...
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Page 8: Table Of Contents
Embedded Computing Platform Table of Contents Revision History........................2 Chapter 1: Introduction ...................... 9 Specifications ......................9 Ordering Information ....................10 Chapter 2: System Overview ..................... 11 Mechanical Drawing....................11 Block Diagram ......................12 Front I/Os ........................13 Rear I/Os........................14 Chapter 3: Board Layout ....................15 Jumpers & Connectors Locations on the Motherboard ........... 15 Jumper Settings & Connector Pinout (Motherboard) ..........16 Chapter 4: Hardware Setup....................23 Installing SO‐DIMM Memory .................. -
Page 9: Chapter 1: Introduction
Embedded Computing Platform Chapter 1: Introduction Thank you for choosing LEC‐7233. This industrial embedded system is empowered by Intel Baytrail CPU, with the option of Celeron N2807 or J1900. LEC‐7233 provides the necessary performance with low power consumption, ideal as industrial embedded gateway. Regarding I/O features, LEC‐7233 supports 3 x LAN ports, 2 x USB 2.0 ports, 1 x USB 3.0 port, 2 x COM ports and 1 x HDMI port. As an industrial gateway, the system provides internal TPM for security purpose. Product Features: Intel® Celeron N2807 1 x DDR3L SO‐DIMM socket up 4GB USB: 2x USB 2.0 Type‐A ports and 1 x USB 3.0 Type‐A port COM: 2 x RS‐232/485 in D‐Sub9 connectors. DIO: 4 x DI and 4 x DO LAN: 3 x 10/100/1000 Mbps RJ‐45 ports Storage: 1 x mSATA socket Display: 1 x HDMI port TPM pin header PCIe: 1 x mini‐PCIe with SIM card reader (full‐size) and 1 x mini‐PCIe (half‐size) Please refer to the following table for detailed specifications Specifications Processor Intel Bay Trail Celeron N2807, 1.58GHz, Dual Cores Memory 1 x SO‐DIMM socket, supports up to 4GB DDR3L 1333MHz BIOS AMI SPI Flash BIOS Serial 2 x D‐Sub9 male connectors with RS‐232/485 signals ... -
Page 10: Ordering Information
Ethernet Controller Intel® i211 Ethernet Ports 3 x RJ‐45 10/100/1000Mbps ports LEDs Green: power‐on/off status Green: wireless network status Yellow: storage access Physical Dimensions 164.5 x 143.0 x 30.0, unit: mm Characteristics Mounting Wall mount, VESA mount Power DC+12V +/‐ 5% input; External AC/DC Adapter, 36W DC Jack w/Lock Reliability Tool Automatic Reboot Lanner Watchdog Timer demo utility with Setting Windows/Linux source code Environment Operating 0°C~50°C (for N2807 CPU with industrial grade Temperature storage and memory. Non‐operating ‐20~70℃ Temperature Humidity 5 to 95% (non‐condensing) Green RoHS Standards & EMC CE, FCC Class A ... -
Page 11: Chapter 2: System Overview
Embedded Computing Platform Chapter 2: System Overview Mechanical Drawing Unit: mm ... -
Page 12: Block Diagram
Embedded Computing Platform Block Diagram ... -
Page 13: Front I/Os
Embedded Computing Platform Front I/Os F1 USB 3.0 1 x USB3.0 Type‐A port F2 USB 2.0 2 x USB2.0 Type‐A ports F3 LAN 3 x 10/100/1000 mbps RJ‐45 LAN ports F4 LEDs Green: power‐on/off status Green: wireless network status Yellow: storage access F5 Reset 1 x Reset button F6 Power Switch 1 x power on/off switch ... -
Page 14: Rear I/Os
Embedded Computing Platform Rear I/Os R1 DC‐IN 1 x DC input jack R2 DIO 5‐pin terminal block supporting 4xDI and 4xDO R3 COM 2 x D‐sub COM ports with RS‐232/485 signals R4 HDMI 1 x HDMI port R5 SMA Antenna (Optional) 2 x SMA antenna holes (the antennas are NOT included by default) ... -
Page 15: Chapter 3: Board Layout
Embedded Computing Platform Chapter 3: Board Layout Jumpers & Connectors Locations on the Motherboard DCJACK1 COM1-2 DIO1 HDMI1 JSP1 SATAPWR1 SATA1 MPE3 DIMM1 MPE1 MSATA1 JCMOS1 JLPC1 JTPM1 JVGA1 ... -
Page 16: Jumper Settings & Connector Pinout (Motherboard)
Embedded Computing Platform Jumper Settings & Connector Pinout (Motherboard) HDMI1: High‐Definition Multimedia Interface connector Pin Description Pin Description 1 DATA2+ 2 GND 3 DATA2‐ 4 DATA1+ 5 GND 6 DATA1‐ 7 DATA0+ 8 GND 9 DATA0‐ 10 CLK+ 11 GND 12 CLK‐ 13 N.C 14 N.C 15 DDC CLK ... - Page 17 Embedded Computing Platform LAN1/2/3: LAN Connector(RJ‐45 connector with LED) Pin Description 1 TXD+ MD0+ 2 TXD‐ MD0‐ 3 RXD+ MD1+ 4 T45 MD2+ 5 T45 MD2‐ 6 RXD‐ MD1‐ 7 T78 MD3+ 8 T78 MD3‐ 9 10‐/100‐/1000+ 10 10+/100+/1000‐ 11 NC 12 NC 13 Active LED‐（yellow） 14 ...
- Page 18 Embedded Computing Platform USB2/USB3: USB2.0 Type‐A Connectors in double‐stacked form USBB2/3 Pin Description 1 USB_VCC1 2 ‐USB 3 +USB 4 GND 0 USB_VCC2 6 ‐USB 7 +USB 8 GND DIO: 2x5‐pin Digital I/O terminal block with 4 x DI and 4 x DO Pin Signal Pin Signal 1 DI_0 2 DO_0 ...
- Page 19 Embedded Computing Platform COM1/COM2: 2 x DB‐9 COM ports Pin Signal Pin Signal 1 COM_DCD1# 6 COM_DSR1# 2 COM_RXD1 7 COM_RTS1# 3 COM_TXD1 8 COM_CTS1# 4 COM_DTR1# 9 COM_RI1# 5 GND JTPM1: TPM module pin header for security and protection Pin Signal Pin ...
- Page 20 Embedded Computing Platform MPCIE1: mini‐PCIe Slot /w SIM (Full Size) Pin Description Pin Description 1 WAKE# 2 +3.3V 3 RSVD 4 GND 5 RSVD 6 +1.5V 7 CLKREQ# 8 UIM_PWR 9 GND 10 UIM_DATA 11 REFCLK‐ 12 UIM_CLK 13 REFCLK+ 14 UIM_RESET 15 GND 16 ...
- Page 21 Embedded Computing Platform MSATA1: mSATA slot for storage device (full‐sized form) Pin Description Pin Description 1 N.C 2 +3.3V 3 N.C 4 GND 5 N.C 6 N.C 7 N.C 8 N.C 9 GND 10 N.C 11 N.C 12 N.C 13 N.C 14 N.C 15 GND 16 ...
- Page 22 Embedded Computing Platform DCIN1: DC Power Jack Pin Description 1 DC_IN (12V) 2 DC_IN (‐) CMOS1: Clear CMOS CMOS1 CMOS1 Short Pins Description 1‐2 Normal (Default) Normal(Def) 2‐3 Clear CMOS Clear CMOS J_RST1: 2‐pin reset pin header Pin Description 1 Ground 2 Reset SPI1: SPIROM pin header for debug purpose SPI1 Pin Description ...
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Page 23: Chapter 4: Hardware Setup
Embedded Computing Platform Chapter 4: Hardware Setup Accessing the Inside of LEC‐7233 To access some components and perform certain service procedures, you must perform the following procedures first. WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment, please remove all power sources. Please wear ESD protected gloves before conducting the following steps. Do NOT pile items on top of the system to prevent damages due to this improper use. Lanner is not liable for damages caused by improper use of the product. 1. Power off LEC‐7233 and remove the power cord. 2. Remove the screws from all sides and the rear, as circled in the image below. Please also remove the four rubber pads as well. It is recommended to use screwdriver sized 3 for these M3 dimension nails. ... - Page 24 Embedded Computing Platform 3. Slide and open the chassis. ...
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Page 25: Installing So-Dimm Memory
Embedded Computing Platform Installing SO‐DIMM Memory The system is designed with a SO‐DIMM socket supporting up to 4GB DDR3L 1333MHz. Please follow the steps below for proper installations. 1. Locate the SO‐DIMM socket on the motherboard. 2. Align the memory module’s key with the SO‐DIMM socket’s key. 3. Insert the SO‐DIMM module. 4. Press the module down until it is locked by the two clips at each side. ... -
Page 26: Installing Msata And Mini-Pcie Module
Embedded Computing Platform Installing mSATA and Mini‐PCIe Module The system provides a mSATA and a mini‐PCIe sockets for internal storage. Please follow the steps below for installations. 1. Locate the mSATA and the mini‐PCIe socket. 2. Align the mechanical notches between the module and the socket. 3. Insert the module into the socket. 4. Secure the installed module with two screws. ... -
Page 27: Appendix 1: Watchdog Timer
Embedded Computing Platform Appendix 1: Watchdog Timer A watchdog timer is a piece of hardware that can be used to automatically detect system anomalies and reset the processor in case there are any problems. Generally speaking, a watchdog timer is based on a counter that counts down from an initial value to zero. The software selects the counter’s initial value and periodically restarts it. Should the counter reach zero before the software restarts it, the software is presumed to be malfunctioning and the processor’s reset signal is asserted. Thus, the processor will be restarted as if a human operator had cycled the power. To download sample watchdog code, please refer to our official website at www.lannerinc.com. Reset Watchdog Timer Processor Restart Clock ...