Figure 5. Interconnection Diagram; Interconnection Diagram - Nokia 9000i Service Manual

Rae, rak-1 series

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The MCM 2 contains the 6 ICs in DSPU, AUDIO, ASIC and RFI

submodules plus bypass capacitors and some resistors. The PWRU

module is laid out in the CMT board using conventional SMD assembly.

The rest of the functional modules are partly packaged in the MCM's and

partly SMD assembled on the CMT board. In the latter description of the

modules the functional partitioning will be used.

Name of submodule

routed via SCL

Table 2. List of Physical Submodules

Contains MCU, SCL, 2xFLASH, 2xSRAM and EEPROM

Contains DSP, 2xSRAM, ASIC, RFI and CODEC

A(19:0),D(15:0)

Figure 1. Interconnection diagram

Technical Documentation

12 bit parallel +

UIF controls

SIM controls

Original, 08/96

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