Protection Against Electrostatic Breakdown - Sony CXD2701Q Data Book

2)
Protection against
electrostatic
breakdown
There
have
been problems concerning
electrostatic
destruction
of electronic
devices
since
the
2nd World
War.
Those
are
closely
related to the
advancement
made
in
the
field
of
semiconductor
devices;
this
is,
with the
development
of
semiconductor technology,
new
problems
in
electrostatic
destruction
have
arisen.
This
situation,
perhaps,
can
be
understood by
recalling
the case
of
MOS
FET.
Electrostatic destruction
is
again drawing
people's attention
as
we
are entering the era
of
LSI,
VLSI,
and
ULSI.
Here
are
our sugges-
tions for preventing such destruction
in
the
device fabrication process.
Factors
causing
electrostatic
generation
in
manufacture process
A
number
of
dielectric
materials are
used
in
manufacture
process.
Friction
of
these mate-
rials
with the substrate
can generate
static
electricity
which
may
destroy
the
semicon-
ductor
device.
Factors
that
can cause
electrostatic des-
truction
in
the
manufacture process
are
shown
below:
Causes
of
electrostatic
destruction
of
semiconductor
parts
in
manufacture
process
Input
1
Item
semi-
conductor
resistor
capacitor
Parts
mounting
•
belt
conveyer
•
work
table
•
human
body
•
Parts hox
solder dipping
• dipping machine
-
visual
correction
•
work
table
•
human
body
• soldering
iron
J
lead cutting
• cutting machine
1
sand
blasting
•
sand
blasting
machine
1
soldering correction
1
•
belt
conveyer
rear side
mounting
of parts
frame assembly
• work
table
•
human
body
• parts
box
.
* soldering
iron
inspection
and repair
Output
-
11
-