Bosch BME280 Mounting Instructions page 12

Bosch Sensortec | HSMI BME280
Figure 2: Minimize the thickness of the metal interconnections with adequate distance to heat sources (like C) to
circumvent heat conduction (left top). Trenches (yellow lines) around the sensor minimizes thermal conduction
throughout the PCB (top right). Thick metal interconnections will enhance heat transport from a heat source to the
sensor and should be avoided (left bottom). Heat sources close to the sensor will heat-up the sensor (bottom right).
 Protect the sensor from heated air to avoid convection and radiation which leads to warming-up
Document number BST-BME280-HS006-00 | May 2018
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parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Note: Specifications within this document are subject to change without notice.
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