Nokia 6310 Manual page 2

Customer Care Europe, Middle East & Africa
SCCE Training Group
General
-How to use this document
Place the colored schematics behind this manual.
Now you are able to follow these specifictions with graphical layouts and it is easier for you to find the components
and measuring points.
-General handling
Be very careful when disassembling the NPE-4/NPL-1 while removing the A-Cover from the Back-Cover.
Refer to disassembling instructions at the service manual of NPE-4/NPL-1.
- Broken balls / underfill, µBGA
All replaceable (not underilled) µBGA components must be renewed after removing.
Reflow with uncontrolled hot air fan is strictly forbidden!
The µBGA must be soldered with NMP approved µBGA rework machines (e.g. Zevac / OK-Metcal / Martin) only .
Check the soldering points after removing a µBGA. Rework the oxidated solderings (broken balls) carefully by tinplating
these areas with few flux and a hot soldering iron, if it is necessary.
Before placing a new component remove the tin and clean the PCB, e.g. with help of soder wick and flux cleaner such as
"Kontakt LR". Use only the mmended Fluxtype and an appropriate amount of it – avoid to wning the PCB in flux as this
will result in additional faults!
Also check underfilled parts for broken underfill material below. In this case carefully evaluate possible repair actions as
the phone probably was exposed to strong mechanical stress.
"rework" done with uncontrolled hot air
© NMP 2003
CONFIDENTIAL
NPE-4 6310/NPL-1 6310i
Date 22.04.2003
PCB drowned in flux
Checked by:
SCCE Training Group
2 (29)
Repair Hints
Version 3.0 Approved
broken underfill of an µBGA part
Approved by:
SCCE