Lenovo ThinkStation P360 Tower Hardware Maintenance Manual page 110

• "Graphics card holder" on page 64
• "Graphics card" on page 65
• "M.2 solid-state drive and heat sink" on page 69
• "Optical drive cage" on page 74
• "Front fan" on page 82
• "Rear fan" on page 83
• "Heat-sink-and-fan assembly" on page 84
• "Chassis beam" on page 88
• "Memory module" on page 89
• "Coin-cell battery" on page 92
• "E-lock" on page 92
• "Front I/O bracket, power button cable, and card reader" on page 93
• "Internal speaker" on page 95
• "Wi-Fi card" on page 96
• "Cover presence switch cable and bracket" on page 101
• "Microprocessor" on page 102
2. Record the cable routing and cable connections, and then disconnect all cables from the system board.
See "System board" on page 50.
Removal steps
Notes:
• Ensure that a new VRM heat sink is installed when you install the system board. If the new system board
does not come with a VRM heat sink, see "VRM heat sink" on page 105 to install one first.
• The failing system board must be returned with a microprocessor socket cover to protect the pins during
shipping and handling.
Microprocessor socket cover installation procedure
1. After you have removed the microprocessor from the failing system board, close the microprocessor
retainer. Then, put the lever to the locked position to secure the retainer in place.
2. Note the orientation of the socket cover, and install one side of the socket cover into the microprocessor
socket. Carefully press the other side of the socket cover downward until the socket cover snaps into
position.
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P360 Tower Hardware Maintenance Manual