Nokia 6310i Service Manual page 102

NPL-1
3 - Audio System
Pin Name Min
8 XMIC 2.0
0
2.5
100
9 SGND
10 XEAR
16
4.7
16
2.78
HEAR 0
11 MBUS
0
2.0
12 FBUS_R
0
X
2.0
13 FBUS_TX
0.1
1.7
14 L-GND 0
3DJH 
7DEOH 
System connector pin assignment
Typ Max Unit
k Ω
2.2
1 Vpp
1.55 V
2.9 V
600
µA
2 Vpp
Ω
330
Ω
47
10 µF
Ω
300
k Ω
10
1.0 Vpp
k Ω
6.8
Ω
1500
2.8 2.86 V
14 220 mV
V
0.8
2.8
V
0.8
2.8
V
0.8
2.8
0 V
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PAMS Technical Documentation
Notes
Input AC impedance
Maximum signal level
Mute (output DC level)
Unmute (output DC level)
Bias current from UEM
Microphone signal (Gain 0 dB)
Connected to UEM MIC3P + MIC2P input
Resistance to phone ground, return path
for XMIC. When the DLR-3 datacable is
connected, SGND swhiches to be a supply
line for the cable (2.8V)
Output AC impedance (ref. LGND)
Series output capacitance
Load AC impedance to GND (Headset) pin
#14
Load AC impedance to GND (Accessory)
pin #14
Maximum output level (no load)
Load DC resistance to GND (Accessory)
pin #14
Load DC resistance to GND (Headset) pin
#14
DC voltage (47k pull-up to Vflash1)
Earphone signal
Connected to UEM HF output
Serial bi-directional control bus.
Baud rate 9600 Bit/s
Phone has 4.7k Ω pull up resistor in UEM
Fbus receive. Serial Data
Baud rate 9.6k-230.4kBit/s
Phone has 220k Ω pull down resistor
Fbus transmit. Serial Data
Baud rate 9.6k-230.4kBit/s
Phone has 47k Ω pull up resistor in UEM
Supply ground
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