Revision History - Philips Nexperia PNX2000 Product Data

Philips audio video input processor product data
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Philips Semiconductors
[3]
[4]
[5]
[6]
[7]
[8]

14. Revision history

Table 28:
Revision history
Rev Date
CPCN
03
20040823
02
20040712
01
20040504
9397 750 13928
Product data
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package
body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Hot bar or manual soldering is suitable for PMFP packages.
Description
Minor revision (9397 750 13928)
Upgraded to Product data (9397 750 13591).
Preliminary data (9397 750 12066)
Rev. 03 – 23 August 2004
PNX2000
Audio video input processor
Table 3
and
Table 4
added.
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
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