Chapter 1. Introduction; Features - Lenovo ThinkSystem SD550 V3 User Manual

Chapter 1. Introduction

Lenovo ThinkSystem SD550 V3 (Types 7DD2 and 7DD9) is a dense and economical two-socket node in a 2U
rack form factor. Combining the efficiency and density of blades with the value and simplicity of rack-based
servers, SD550 V3 delivers a cost-efficient scaleout platform that is thermally designed to deliver maximum
performance in the smallest footprint. In the system, up to two SD550 V3 nodes with front access can be
installed in a 2U D3 Chassis (Types 7DD0 and 7DD7). Each node incorporates two fifth-generation Intel Xeon
Scalable processors. SD550 V3 is well suited for workloads ranging from cloud, analytics to AI and high-
performance computing application like Computer Aided Engineering (CAE) or Electronic Design Automation
(EDA).

Features

Performance, ease of use, reliability, and expansion capabilities were key considerations in the design of
your system. These design features make it possible for the user to customize the system hardware to meet
the needs today and provide flexible expansion capabilities for the future.
Chassis feature
• Redundant optional power capabilities
The chassis supports up to three 1300-watt, 1600-watt, or 2700-watt hot-swap CRPS AC power supplies,
which provide redundancy.
Important: Power supplies and redundant power supplies in the chassis must be of the same brand,
power rating, wattage, or efficiency level, with the same latch color.
• Chassis management
The chassis midplane with PSoC (Programmable System on Chip) allows monitor and management of
nodes and power supply units in the chassis. A chassis caretaker node is selected by the PSoC
firmware for chassis management.
For the management interface, see
functions can only be performed by the caretaker node, whereas other functions can be performed by all
nodes.
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https://pubs.lenovo.com/lxcc-overview/
. In XCC, certain management
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