Table of Contents
Advertisement
6-3.
NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
Note on Printed Wiring Board:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
•
: internal component.
f
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
Parts on the pattern face side seen from
(Conductor Side)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Component Side) the parts face are indicated.
• MAIN board is multi-layer printed board.
However, the patterns of intermediate layers have not
been included in this diagrams.
∗ Replacement of IC501 and IC801 used in this set re-
quires a special tool.
• Lead Layouts
surface
Lead layout of conventional IC
CSP (chip size package)
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and
1
/
W or less unless otherwise
4
specified.
•
: internal component.
f
• C : panel designation.
Note:
Note:
The components identi-
Les composants identifiés par
fied by mark 0 or dotted
une marque 0 sont critiques
line with mark 0 are criti-
pour la sécurité.
cal for safety.
Ne les remplacer que par une
Replace only with part
pièce por tant le numéro
number specified.
spécifié.
• A : B+ Line.
• Total current is measured with MD installed.
• Power voltage is dc 3 V and fed with regulated dc power
supply from DC IN 3 V jack (JK951).
• Voltages and waveforms are dc with respect to ground in
playback mode.
no mark : PLAYBACK
(
) : REC
〈〈
〉〉 : USB
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
J
: PLAYBACK
f
: REC
F
: USB
• Abbreviation
EE
: East European model
∗ Replacement of IC501 and IC801 used in this set re-
quires a special tool.
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
form that of conventional IC.
• Waveforms
1 IC501 9 (RFO)
1.2 Vp-p
2 IC501 rd (TE)
Approx.
400 mVp-p
3 IC501 rs (FE)
Approx.
350 mVp-p
4 IC601 4 (CLK)
2.3 Vp-p
5.67 ns
33
33
5 IC801 2 (OSCO)
2.1 Vp-p
44.6 ns
6 IC801 <z,/> (UOSCO) (USB mode)
2.7 Vp-p
21 ns
7 IC901 yd (CLK)
2.3 Vp-p
5.67 ns
AM-NX9
Ver 1.1
Advertisement
Table of Contents
