Pad Layout - Epson S1D16000 Series Technical Manual

S1D16400 Series

5. PAD LAYOUT

95
100
105
1 5
Au bump specification (S1D16400D00B
Bump size
Bump size
Bump size
Bump size
Bump height A ~ D
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2–4
90 85 80
10
Chip size ............................ 11.59mm x 1.40mm
Pad pitch ............................ 105µm (Min.)
Chip thickness .................... 625µm ±25µm
160µm × 80µm ±4µm
A
86µm × 91µm ±4µm
B
86µm × 68µm ±4µm
C
82µm × 74µm ±4µm
D
22.5 ±5.5µm
75 70 65 60
(0,0)
15
) reference values
*
(Pad No. 2 ~ 26)
(Pad No. 1, 27, 37 and 98)
(Pad No. 28 ~ 36 and 99 ~ 107)
(Pad No. 38 ~ 97)
(Pad No. 1 ~ 107)
EPSON
55 50 45 40
20
35
30
25