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S1D16006 Series
5. PAD
Pad Layout
85
90
95
100 1
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Au bump specifications [Reference values]
Bump size:
Bump height:
AL-pad die form
Pad Opening
1–4
75
80
5
10
Chip size: ........................... 5.59 mm × 3.50 mm
Pad pitch: ........................... 0.153 mm (Min.)
Chip thickness: ................... 0.400 mm (AL-pad die form)
117µm × 109µm ± 20 um
17µm to 28µm (Details shall be stipulated in the delivery specification.)
87×76µm
70
65
60
Y
(0.0)
20
15
0.525 mm (Au-bump die form)
EPSON
50
55
X
D1606D
0B
25
30
45
40
35
Rev.2.1
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