Dimensions And Interfaces - Huawei MC509 Series Hardware Manual

HUAWEI MC509 Series CDMA LGA Module
Hardware Guide
Table 6-1 Baking parameters
Baking
Temperature
125º C± 5º C

6.4 Dimensions and interfaces

The dimension of MC509 is 30 mm (length) × 30 mm (width) × 2.65 mm (height).
Figure 6-1 shows the dimensions of MC509 in details.
Issue 02 (2013-05-06)
Baking
Condition
Relative
humidity ≤ 60%
Moving, storing, and processing the product must comply with IPC/JEDEC J-STD-033.
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Baking
Remarks
Duration
8 hours
Mechanical Specifications
59