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HUAWEI 30 mm x 30 mm LGA Module Development Kit Guide Issue Date 2016-12-12...
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Thus, the descriptions herein may not exactly match the product or its accessories which you purchase. Huawei reserves the right to change or modify any information or specifications contained in this manual without prior notice and without any liability.
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HUAWEI 30 mm x 30 mm LGA Module Development Kit Guide About This Document About This Document Revision History Document Date Chapter Descriptions Version 2011-10-20 Creation 2014-04-26 Updated 2015-03-16 Added the description of the interface board 30X30LGADB VER.A Added the description of ME209u-526...
HUAWEI 30 mm x 30 mm LGA Module Development Kit Guide Contents Contents 1 Overview ..........................6 1.1 About This Chapter.......................... 6 1.2 Feature Overview ..........................6 1.3 Introduction to the DVK ........................8 1.4 Components of the DVK........................ 11 2 Installation and Use Guide ....................
Components of the DVK 1.2 Feature Overview The 30 mm x 30 mm LGA module DVK supports MU509 series, MC509 series, MU609, MU709 series, ME909u series, ME209u-526 and ME909s series module. Table 1-1 describes the features of DVK supported by LGA modules.
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HUAWEI 30 mm x 30 mm LGA Module Development Kit Guide Overview ME209u- Feature Implementation MC509 MU509 MU609 ME909u MU709 ME909s √ √ √ √ √ √ √ Main Standard SIM card √ √ √ √ √ √ √ socket...
HUAWEI 30 mm x 30 mm LGA Module Development Kit Guide Overview ME209u- Feature Implementation MC509 MU509 MU609 ME909u MU709 ME909s Module status √ √ Reserved Reserved Reserved Reserved Reserved indicator Module mode √ √ √ √ √ √ √...
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HUAWEI 30 mm x 30 mm LGA Module Development Kit Guide Overview The mother board (MD0MU609M02 VER.B) is the universal board and can be used in all 30 mm x 30 mm LGA modules, as shown in Figure 1-1 .
HUAWEI 30 mm x 30 mm LGA Module Development Kit Guide Overview Consisting of a dedicated interface board and accessories, the DVK provides the following interfaces: Two Micro USB interfaces, one is used for power supply and the other is used to communicate.
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HUAWEI 30 mm x 30 mm LGA Module Development Kit Guide Overview The mother board and the interface board have been assembled when you obtain the DVK. You do not need do the assembly by yourself. The mother board and the interface board should be assembled correctly to ensure ...
HUAWEI 30 mm x 30 mm LGA Module Development Kit Guide Installation and Use Guide Installation and Use Guide 2.1 About This Chapter This chapter describes how to install and use the LGA module's DVK. 2.2 Setting Up the DVK This chapter takes MC509 interface board (ML0ME909UM VER.B) and ME209u-526...
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HUAWEI 30 mm x 30 mm LGA Module Development Kit Guide Installation and Use Guide Figure 2-2 Inserting a standard SIM card into the SIM card socket (for the interface board ML0ME909UM VER.B) Standard SIM card Figure 2-3 Inserting a standard SIM card or Micro SIM card into the standard SIM card socket or the Micro SIM card socket (for the interface board 30X30LGADB VER.A)
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HUAWEI 30 mm x 30 mm LGA Module Development Kit Guide Installation and Use Guide Figure 2-4 Connecting the antenna (for the interface board ML0ME909UM VER.B) MAIN Figure 2-5 Connecting the antenna (for the interface board 30X30LGADB VER.A) MAIN Step 4 Connect one USB cable from adapter to the Micro USB port on the mother board directly.
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HUAWEI 30 mm x 30 mm LGA Module Development Kit Guide Installation and Use Guide Figure 2-6 Connecting the USB cable from adapter to the Micro USB port on the mother board Step 5 To communicate with a PC, connect the other USB cable to the Micro USB port on the interface board directly.
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SPK OUT MIC2 EAR OUT MIC1 Only MU509 series and MC509 series module support analog audio. Step 7 Lift the switch S701 on the mother board first, and then turn S701 to the "ON" position. Huawei Proprietary and Confidential Issue 05 (2016-12-12)
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The DVK supports 3 UART ports but the module may not support all the UART ports. For example, MC509 and MU509 series module only support UART0; MU609 module supports UART0 and UART1 but not UART2. For details, you can refer to module's hardware guide.
HUAWEI 30 mm x 30 mm LGA Module Development Kit Guide Interface Description Interface Description 3.1 About This Chapter This chapter describes the DVK appearance, interface functions, and interface usage of the DVK. DVK Appearance Interface Functions ...
HUAWEI 30 mm x 30 mm LGA Module Development Kit Guide Interface Description Figure 3-1 Appearance of the DVK (top view) 3.3 Interface Functions 3.3.1 Power Interface Power can be supplied to the DVK by the Micro USB 5 V power supply port on the mother board as showed in chapter 2.2 .
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HUAWEI 30 mm x 30 mm LGA Module Development Kit Guide Interface Description Figure 3-2 LED indicators on the mother board Table 3-1 Functions of the LED indicators on the DVK Position Mark on the DVK Color Function of the LED When It...
The DVK provides a 3.5 mm HEADSET connector on the interface board. You can connect a D3.5 4P plug earphone to test the PCM function. The handset is ready for analog radio which is used for MU509 series and MC509 series module.
HUAWEI 30 mm x 30 mm LGA Module Development Kit Guide Interface Description For more information on the characteristics of the SIM card interface, please refer to the module's hardware guide. 3.3.7 Micro SD Card Interface The DVK provides a micro SD card interface. Customers can insert a micro SD card into the socket as memory function.
HUAWEI 30 mm x 30 mm LGA Module Development Kit Guide Interface Description Figure 3-7 HS_UART1 LS<-UART1: UART1 DB9 port on the mother board can be used, but HS_UART1 port on the interface board cannot be used. ON<-POWER: the POWER_ON_OFF signal is pulled down to GND. In this situation, once the module is supplied power, it will be powered on automatically.
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HUAWEI 30 mm x 30 mm LGA Module Development Kit Guide Interface Description Figure 3-8 Test points (for the interface board ML0ME909UM VER.B) Table 3-2 Test point assignment on the the interface board ML0ME909UM VER.B Screen Name Signal Name Screen Name...
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HUAWEI 30 mm x 30 mm LGA Module Development Kit Guide Interface Description Screen Name Signal Name Screen Name Signal Name SD_CK SD_CLK TP1103 Only for internal use LED2 LED2 (LGA pin 91) VBAT VBAT TP1106 Only for internal use...
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HUAWEI 30 mm x 30 mm LGA Module Development Kit Guide Interface Description Screen Name Signal Name Screen Name Signal Name EX2V6 VCC_EXT_2V6 AMIC_N HANDMIC_N VCOIN VCOIN AMIC_P HANDMIC_P ADC102 ADC1 (LGA pin 102) ASPK_N HANDSPK_N ADC104 ADC2 (LGA pin 104)
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HUAWEI 30 mm x 30 mm LGA Module Development Kit Guide Interface Description Figure 3-9 Test points (for the interface board 30X30LGADB VER.A) Table 3-3 Test point assignment on the the interface board 30X30LGADB VER.A Screen Name Signal Name Screen Name...
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HUAWEI 30 mm x 30 mm LGA Module Development Kit Guide Interface Description Screen Name Signal Name Screen Name Signal Name IO51 GPIO (LGA pin 51) TP1103 Only for internal use EX2V6 VCC_EXT_2V6 RESIN RESIN_N RS94 Reserved PS_HOLD PS_HOLD IO113...
HUAWEI 30 mm x 30 mm LGA Module Development Kit Guide Interface Description Screen Name Signal Name Screen Name Signal Name SD_DT SD_DET HSICC Reserved VCHG VCHG SD_D0 SD_DATA0 VCC_EXT1_1V8 VCC_EXT1_1V8 SD_CM SD_CMD USBID USB_ID SD_D1 SD_DATA1 VBUS USB_VBUS 0_CTS...
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HUAWEI 30 mm x 30 mm LGA Module Development Kit Guide Interface Description Figure 3-10 Deleting R551 For interface board ML0ME909UM VER.B, delete R551 and R635. Figure 3-11 Deleting R551 and R635 Step 1 Disassemble the mother board and the interface board.
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HUAWEI 30 mm x 30 mm LGA Module Development Kit Guide Interface Description VBAT Step 3 Set the voltage of the external power supply to be 3.8 V. The current range is not limited. Step 4 Power on the LGA module and record the current for different working status.
HUAWEI 30 mm x 30 mm LGA Module Development Kit Guide Acronyms and Abbreviations Acronyms and Abbreviations Acronym or Abbreviation Expansion Alternating Current Clear to Send Direct Current Double In-line Package Data Terminal Equipment Development Kit Global Position System Land Grid Array...