Chapter 2. CPU Features & Specifications
2.4
RSTi-EP CPU Features and Specifications
Lifecycle Phase
Microprocessor Specification
Operating System
#RX3i Slots Occupied
Backplane
Temperature Range
Power Requirements
RSTi-EP +3.3Vdc
RSTi-EP +24Vdc Relay with Energy Pack
RSTi-EP +24Vdc Relay w/o Energy Pack
Input Power (Max)
Input Voltage (Min)
Input Voltage (Max)
Memory Backup Mechanism
Display
Firmware Upgrade
CPU Firmware Upgrade Mechanism
Indirect Backplane Module Upgrade
Program Portability
Direct Import (with limitations)
RX3i PACSystems Applications using
Family Type Conversion
Program Security
Trusted Platform Module (TPM)
Program Storage
Battery-backed RAM
Non-Volatile Flash
Battery Life Expectancy, RAM Backup
Life Expectancy, Energy Pack Capacitors
56
See Battery Compatibility and Memory Retention (Time in Days at 20°C) in GFK-2741
57
See corresponding IPI for target CPU.
58
Battery-backed RAM.
98
CPE100/CPE115
Active
1GHz TI AM335x
Sitara SoC
VxWorks
N/A
Standalone
RSTi-EP
-40°C to 70°C
N/A
RSTi-EP +5 Vdc
N/A
N/A
N/A
6 W (250mA@
24Vdc)
9Vdc
30Vdc
Internal super
56
capacitor
LEDs
Web Interface
Ethernet Port
N/A
57
N/A
Secure Boot
Y (Disabled)
1 /1.5 Mbytes
512 Mbytes
56
N/A
15 Years if ambient
temp is 40°C
PACSystems* RX7i, RX3i and RSTi-EP CPU Reference Manual
Y
Y
58
GFK-2222AD