In S I De T He Hp 8110Α - HP 8110A Service Manual

HP 811 CIA Service Guide
In
si
d
e t
h
e HP 8110Α
T
ake α
l ook at Figure 5-1 .
I
t shows th e top view
o
f an instrument
wit h the case removed, wi th α full complement of P C
b
oards.
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FRO
M P
ANEL
F
igu r e 5-1 . Top
V
iew of HP 8110 Α
Un der n eat h th e Mi croprocessor (MPU)
b
oard is the
P ower S upply
b oard (s h own in Figure 5-8) . On t he undersi de of the chassi s
t h ere are 1 or 2 Output
b
oards ( Figure 5-9 an d Figure 5-10) . Thi s
rep resents α fully fitted instrument . Th e in strument
y
ou are ab out to
service
m ay h a v e severa l combin ation s of boards .
Th e Standar d HP 8110 Α contains :
ι
P
o wer S upply Uni t
ι MPU b oard
ι
P
eriod
b
oard
ι O u t pu t 1
b
oard
In addition , the instrume nt
m ay have been
o
p tionally fitted with, or
retrofitted wit h some or all of t he
f
o ll owing
b
oards:
Disassembly and
R
eassembly 5-3