HP E840 A Series User And Service Manual page 60

Electromagnetic
Compliance
Specifications
60 HP E8401A, E8403A Product Specifications
Conducted Emissions
Conforms to EN55011, CISPR11, Group 1 Class A
Conforms to EN61000-3-2, IEC 1000-3-2, Class A, Harmonic Current
Conforms to EN61000-3-3, IEC 1000-3-3, Class A, Voltage Fluctuation
and Flicker
Conducted Immunity
Conforms to EN50082-1, IEC 1000-4-4, Fast Transients Immunity
Conforms to EN61000-4-5, IEC 1000-4-5, Surge Immunity
Conforms to ENV50141, IEC 1000-4-6, Conducted Immunity
Conforms to EN61000-4-11, IEC 1000-4-11 Voltage Dips &
Interruptions
Radiated Emissions
Conforms to EN55011, CISPR11, Group 1 Class A
Radiated Field Immunity
Conforms to EN50082-1, IEC 1000-4-3, Radiated Field Immunity
ESD Immunity
Conforms to EN50082-1, IEC 1000-4-2, 4kV CD, 8kV AD
Magnetic Field Immunity
Conforms to EN61000-4-8, IEC 1000-4-8, Level 2, Magnetic Field
Immunity
EMC Accessories: The standard mainframe is suitable for the majority of
applications. For more demanding EMC applications, the following
accessories are available:
-- Chassis Shield Kit (E8400-80919) per VXI Specification Rev. 1.4,
B.7.3.4. The chassis shield is used to provide additional isolation or
shielding between noisy or sensitive modules. This may be useful,
for example, with custom modules that do not meet the VXI
near-field radiation spec. The HP chassis shields are easy to install
and are grounded in all four corners (patent applied).
-- Backplane Connector Shields (E8400-80918) per VXI Specification
Rev. 1.4, B.7.3.1. Backplane connector shields are useful for
improving the ground connection between a module and the
backplane. For a few modules, they are necessary for emc
compliance to EN55011 and CISPR11. For the vast majority of
modules, they are not necessary. Note that these shields are only
useful if the module includes contacts conforming to VXI spec
B.7.2.3.
-- EMC Filler Panels (E8400-60202) per VXI Specification Rev. 1.4,
B.7.2.3. EMC Filler Panels are used to provide a continuous
connection across the front opening of the mainframe. All HP
modules include emc contacts to the adjacent slot. Using EMC
Filler Panels in the empty slots completes the connection and
reduces radiated emissions and increases radiated and esd
immunity.
Appendix A