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SUB
IN
MOUNTING DIAGRAM
(S)
SUB
IN
BOARD
SCHEMATIC
DIAGRAM
(5)
SUB
IN
BOARD
SUBIN
HPA
MOUNTING DIAGRAM
(6)
HPA
BOARD
J
102-2
JI02-I
• Semiconductor Lead Layouts
NJM4560D
Note:
•
Color
code
of
sleeving
over the
end
of the
jacket.
•
o
—
:
parts
extracted
from
the
component
side.
•
©
:
fusible
resistor.
•
:
B +
pattern
•
H13
:
B
—
pattern
•
®
:
Through
hole.
Note:
•
All
capacitors
are
in
n
F
unless
otherwise noted.
pF
:
ppF
50WV
or
less
are
not
indicated
except
for electrolytics
and
tantalums.
All resistors
are
in
ohms,
%W
unless
otherwise noted.
k«
:
lOOOfi,
Mn
:
lOOOkB
:
panel
designation.
B+
bus.
B-
bus.
Readings
are
taken under
no-signal
conditions with
a
VOM
(50
kn/V).
Note:
The components
identified
by
shading
and
mark
are
critical
for
safety.
Replace only with
part
number
specified.
Note: Les
composants
identifies
par
un
trame
et
une
marque
^sont
critiques
pour
la
securite.
Ne
les
remplacer
que
par
une
piece portant
le
numero
specifie.
Note: Voltages
are
measured
with
a
VOM
(50k£2/V).
• Semiconductor
Lead Layouts
NJM45600
(Top view)
2SBS48
1S1555
2S0414
Note:
•
Color
code
of sleeving
over the
end
of the
jacket.
•
o—
:
parts extracted
from
the
component
side.
•
®
:
Through
hole,
•
:
B
+
pattern
•
B
-
pattern
A-28
A-29
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