JVC GR-D370UC Schematic Diagrams page 22

CCD, REAR AND OPE CIRCUIT BOARDS
Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade)
<02>CCD
LYB20025-001B COMPONENT SIDE(A)
L5002
CN5001
<03>REAR
LYB20024-001C FOIL SIDE(B)
S501
CN503
C514
D501
D503
C513
L505
L506
J502
R5002
L5001 Q5001
C5003 C5001
C5005 C5004 C5007 C5006 C5002
R5004
R5001
COMPONENT SIDE(A)
R508
R509
R503
R510
R507
C507
D504
R504
BT501
BT502
C503
R513
C502
R512
J502
(No.YF124)2-41
<04>OPE
LYB20026-001C
CN404
2 1
C510
C504
C501
2-42(No.YF124)
FOIL SIDE(B)
CN403
8 1
1
COMPONENT SIDE(A)
S410
S408 S402 S409
S407
R404
R402
C402
S403
30
CN401