JVC AV-2771S Service Manual page 26

AV-2771S |
M REPLACEMENT OF CHIP COMPONENTS
@ CHIPS ARE NOT USED ON CERTAIN MODELS. REFER TO THE DESCRIPTIONS ON THIS PAGE ONLY WHEN
WORKING ON MODELS ON WHICH CHIPS ARE EMPLOYED.
Replacement of the chip on printed circuit board can be performed easily as follows.
1. When mounted
(Resistor - Capacitor]
Adhesive
2 Removal of the chip
(1) Remove either of the soldered (2) Hold the chip with (3) Work the chip free from
contacts. tweezers and remove the adhesive with tweezers.
the other contact.
— — Tweezers
i
~ Sea e
3 Preheating and soldering of chip pieces
Be sure to preheat chip pieces (except the transistor) especially the
capacitor before soldering with hot air, about 150°C (hair dryer or
such can be used) for about 2 minutes. Then, immediately solder
with an iron of about 30W.
4 Replacing the chip pieces
(1) Apply the solder to the
board first.
(2) Hold the chip with
tweezers and solder it
in place, hold the iron
at a 45° angle when
soldering.
a" @ Discrete parts can be substitutionally mounted as shown
in the figure on the right.
Mounting is also possible by passing the wires from the
board front side (parts side) through the chip soldering
hole (vent hole of registration part).
Substitute parts are as follows.
@ Chip Metal Glaze Resistor
~Carbon Resistor Vl4wW 45%
@ Chip Ceramic Capacitor
—Ceramic Capacitor 50V +5%
@ Decoding of chip parts constant terms <Chip Ceramic Capacitor >
<Chip Metal Glaze Resistor >
: ae
Constant 12 K,M,Z,P----- Tolerance of
peg
term
:
ordinary type
ii Muitiplier ool
qT
C,P,R,S,T,U
- - Temperature
Constant Multiplier 12103 =12000pF SpatiGiontok
boul =0.012pF
12103
=12000Q
epee
= 12kQ
compensation type
26 (No.50577)