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CM-BF537 Hardware User Manual Version 10...
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Hardware User Manual - CM-BF537 Last change: 26. March 2019/Version 10 BECOM Systems GmbH Gutheil-Schoder-Gasse 17 1230 Wien AUSTRIA office.systems@becom-group.com http://systems.becom-group.com CM-BF537 – Hardware User Manual Template No.: 900-520 Rev A Publication date: February 4, 2020 Subject to change without notice. Errors excepted.
Hardware User Manual - CM-BF537 Last change: 26. March 2019/Version 10 Table of Contents Introduction ...............................................6 Overview ..............................................6 Key Features ..........................................7 Applications ..........................................8 General Description ..........................................9 Functional Description ......................................9 Boot Mode ............................................9 Memory Map ..........................................10 2.3.1...
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Hardware User Manual - CM-BF537 Last change: 26. March 2019/Version 10 Side View ............................................24 Footprint ............................................25 Connectors ..........................................25 Support ............................................... 26 General Support ........................................26 Board Support Packages....................................26 Blackfin® Software Support ..................................26 7.3.1 BLACKSheep® OS ......................................26 7.3.2...
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BECOM Systems takes no liability for any damages and errors causing of the usage of this board. The user of this board is responsible by himself for the functionality of his application. He is allowed to use the board only if he has the qualification.
Ethernet physical transceiver (10/100Mbit) onboard. 1.1 Overview The current hardware version (see Version Information) of Core Module CM-BF537-C-C-Q25S32F4 (CM-BF537E) consists of the following components. Parts of mounting options of CM-BF537 are listed in addition. Figure 1-1: Main components of the CM-BF537 Core Module •...
TWI (I²C compatible) PPI (Parallel Port Interface) GPIO’s 1.2 Key Features The CM-BF537 is very compact and measures only 36.5x31.5mm • • Allows quick prototyping of product that comes very close to the final design Reduces development costs, faster time to market •...
PPI, SPORT0, UART1, UART2, SPI, TWI, CAN, GPIO Figure 2-1: Detailed block diagram Figure 2-1 shows a detailed block diagram of the CM-BF537. Other than the SDRAM control pins the CM-BF537 has all other pins of the Blackfin processor on its two main 60 pin connectors.
Last change: 26. March 2019/Version 10 Figure 2-3: Assembly drawing top view Warning BECOM Systems cannot take responsibility for customer-modified boards. If you need modifications, please request a quote at office.systems@becom-group.com. 2.3.3 Externally Addressable Memory (on connector) The Blackfins External Bus Interface (EBI) allows connecting devices via an asynchronous memory interface.
Hardware User Manual - CM-BF537 Last change: 26. March 2019/Version 10 3 Specifications 3.1 Electrical Specifications 3.1.1 Maximum Ratings Stressing the device above the rating listed in the absolute maximum ratings table may cause permanent damage to the device. These are stress ratings only. Operation of the device at these or any other conditions greater than those indicated in the operating sections of this specification is not implied.
Hardware User Manual - CM-BF537 Last change: 26. March 2019/Version 10 Note 1) =1.10V @ T =25°C DDINT Note 3) Average load @ 25°C ambient temperature 3.1.3 ESD Sensitivity ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can discharge without detection.
Hardware User Manual - CM-BF537 Last change: 26. March 2019/Version 10 4 Connector Description 4.1 Connector X1 Pin No. Signal Name Type Function RSCLK0 / TACLK2 SPORT DR0PRI / TACLK4 SPORT TSCLK0 / TACLK1 SPORT DT0PRI / SSEL2 SPORT CLKBUF 25MHz buffered clock output I²C...
Hardware User Manual - CM-BF537 Last change: 26. March 2019/Version 10 Pin No. Signal Name Type Function N.C. BMODE1 I - 10k pull down Boot mode PF12 / MISO GPIO / SPI PF0 / DMAR0 / Tx0 GPIO / UART...
Hardware User Manual - CM-BF537 Last change: 26. March 2019/Version 10 4.2 Connector X2 Pin No. Signal Name Type Function Address Bus Address Bus Address Bus Address Bus Address Bus Address Bus Address Bus Address Bus Address Bus Address Bus...
Hardware User Manual - CM-BF537 Last change: 26. March 2019/Version 10 Pin No. Signal Name Type Function RESET I – see chapter 5.2 Reset Memory Control Bus Memory Control Bus AMS2 Memory Control Bus VDD-RTC Backup battery supply Memory Control Bus...
Hardware User Manual - CM-BF537 Last change: 26. March 2019/Version 10 5 Application Information 5.1 Supply Voltage Decoupling For a better stability we recommend to add a 100nF capacitor for each power supply pin and a 47uF tantalum capacitor to the V voltage rail next to the module.
Hardware User Manual - CM-BF537 Last change: 26. March 2019/Version 10 5.3 Application Example Schematics 5.3.1 RJ45 schematic Figure 5-2: Schematic for RJ45 Connection Designator Value Type Description Quantity RJLBC-060TC1 RJ45 with magnetics R5, R6 220 Ω Resistor 0 Ω...
Hardware User Manual - CM-BF537 Last change: 26. March 2019/Version 10 5.4 Sample Schematic In this minimum configuration the CM-BF537 is used as a high-performance network connected processor module. Figure 5-3: Configuration with Ethernet and JTAG Connector Designator Value Type...
5.5 Stand-alone Ethernet based MPEG webcam The CM-BF537 module can be used as a stand-alone module for a camera system requiring only power supply and the direct attachment of a compatible video camera. An extender board including a camera is available at BECOM...
6 Mechanical Outline 6.1 Top View shows the bottom view of the CM-BF537. All dimensions are given in millimeters. Take 0.5 mm as a Figure 6-1 tolerance for the boarder of the board since it is broken out from a multi-board panel and some additional boarder may remain.
Last change: 26. March 2019/Version 10 6.2 Bottom View Figure 6-2 shows the TOP VIEW of the bottom side components (through the Board View) of the CM-BF537 Core Module. All dimensions are given in millimeters. Figure 6-2: Mechanical outline and Bottom Connectors (Top View) 6.3 Side View...
Figure 6-4: Recommended footprint for the Core Module (top view) The footprint of the CM-BF537 for Altium Designer is available on request. The used connectors can be found in Table 6-1. For detailed dimensions of the connectors please see the datasheet from the manufacturer’s website.
Analog Devices Blackfin® embedded processors. This high-performance OS is based on the reliable and stable real-time VDK kernel from Analog Devices that comes with VDSP++ IDE. Of course, BLACKSheep® OS is fully supported by all BECOM Systems Core- Modules and development hardware.
Table 8-1: Ordering information Note Custom Core Modules are available on request! Please contact BECOM Systems (office.systems@becom-group.com) if you are interested in custom Core Modules. The mount options of the Core Module CM-BF537 are shown in Table 8-2. Mount Option Flash Comment...
Hardware User Manual - CM-BF537 Last change: 26. March 2019/Version 10 9 Dependability 9.1 MTBF Please keep in mind that a part stress analysis would be the only way to obtain significant failure rate results, because MTBF numbers just represent a statistical approximation of how long a set of devices should last before failure.
Hardware User Manual - CM-BF537 Last change: 26. March 2019/Version 10 12 List of Abbreviations Abbreviation Description Analog Devices Inc. Analog Input Asynchronous Memory Select Analog Output Core Module Direct Current Digital Signal Processor Enhanced Core Module External Bus Interface...
Last change: 26. March 2019/Version 10 List of Figures and Tables Figures Figure 1-1: Main components of the CM-BF537 Core Module ............................6 Figure 2-1: Detailed block diagram........................................9 Figure 2-2: PF4 and PF5 routing ..........................................10 Figure 2-3: Assembly drawing top view ......................................11 Figure 5-1: Schematic of reset circuit on the Core Module ............................
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