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CM-BF537
Hardware User Manual
Version 10

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Summary of Contents for Becom CM-BF537

  • Page 1 CM-BF537 Hardware User Manual Version 10...
  • Page 2 Hardware User Manual - CM-BF537 Last change: 26. March 2019/Version 10 BECOM Systems GmbH Gutheil-Schoder-Gasse 17 1230 Wien AUSTRIA office.systems@becom-group.com http://systems.becom-group.com CM-BF537 – Hardware User Manual Template No.: 900-520 Rev A Publication date: February 4, 2020 Subject to change without notice. Errors excepted.
  • Page 3: Table Of Contents

    Hardware User Manual - CM-BF537 Last change: 26. March 2019/Version 10 Table of Contents Introduction ...............................................6 Overview ..............................................6 Key Features ..........................................7 Applications ..........................................8 General Description ..........................................9 Functional Description ......................................9 Boot Mode ............................................9 Memory Map ..........................................10 2.3.1...
  • Page 4 Hardware User Manual - CM-BF537 Last change: 26. March 2019/Version 10 Side View ............................................24 Footprint ............................................25 Connectors ..........................................25 Support ............................................... 26 General Support ........................................26 Board Support Packages....................................26 Blackfin® Software Support ..................................26 7.3.1 BLACKSheep® OS ......................................26 7.3.2...
  • Page 5 BECOM Systems takes no liability for any damages and errors causing of the usage of this board. The user of this board is responsible by himself for the functionality of his application. He is allowed to use the board only if he has the qualification.
  • Page 6: Introduction

    Ethernet physical transceiver (10/100Mbit) onboard. 1.1 Overview The current hardware version (see Version Information) of Core Module CM-BF537-C-C-Q25S32F4 (CM-BF537E) consists of the following components. Parts of mounting options of CM-BF537 are listed in addition. Figure 1-1: Main components of the CM-BF537 Core Module •...
  • Page 7: Key Features

    TWI (I²C compatible) PPI (Parallel Port Interface) GPIO’s 1.2 Key Features The CM-BF537 is very compact and measures only 36.5x31.5mm • • Allows quick prototyping of product that comes very close to the final design Reduces development costs, faster time to market •...
  • Page 8: Applications

    Hardware User Manual - CM-BF537 Last change: 26. March 2019/Version 10 1.3 Applications Robotics • Video security • Video surveillance • Industrial distributed control • Industrial factory automation • Remote monitoring devices • • Point-of-sale terminals VoIP • Biometrics/security •...
  • Page 9: General Description

    PPI, SPORT0, UART1, UART2, SPI, TWI, CAN, GPIO Figure 2-1: Detailed block diagram Figure 2-1 shows a detailed block diagram of the CM-BF537. Other than the SDRAM control pins the CM-BF537 has all other pins of the Blackfin processor on its two main 60 pin connectors.
  • Page 10: Memory Map

    Hardware User Manual - CM-BF537 Last change: 26. March 2019/Version 10 2.3 Memory Map 2.3.1 Core Module Memory Memory Type Start Address End Address Size Comment FLASH Bank0 0x20000000 0x201FFFFF 1/8 of 16MB NOR Flash, (PF4 Flag low) IS29GL256-70DLEB FLASH Bank1...
  • Page 11: Externally Addressable Memory (On Connector)

    Last change: 26. March 2019/Version 10 Figure 2-3: Assembly drawing top view Warning BECOM Systems cannot take responsibility for customer-modified boards. If you need modifications, please request a quote at office.systems@becom-group.com. 2.3.3 Externally Addressable Memory (on connector) The Blackfins External Bus Interface (EBI) allows connecting devices via an asynchronous memory interface.
  • Page 12: Specifications

    Hardware User Manual - CM-BF537 Last change: 26. March 2019/Version 10 3 Specifications 3.1 Electrical Specifications 3.1.1 Maximum Ratings Stressing the device above the rating listed in the absolute maximum ratings table may cause permanent damage to the device. These are stress ratings only. Operation of the device at these or any other conditions greater than those indicated in the operating sections of this specification is not implied.
  • Page 13: Esd Sensitivity

    Hardware User Manual - CM-BF537 Last change: 26. March 2019/Version 10 Note 1) =1.10V @ T =25°C DDINT Note 3) Average load @ 25°C ambient temperature 3.1.3 ESD Sensitivity ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can discharge without detection.
  • Page 14: Connector Description

    Hardware User Manual - CM-BF537 Last change: 26. March 2019/Version 10 4 Connector Description 4.1 Connector X1 Pin No. Signal Name Type Function RSCLK0 / TACLK2 SPORT DR0PRI / TACLK4 SPORT TSCLK0 / TACLK1 SPORT DT0PRI / SSEL2 SPORT CLKBUF 25MHz buffered clock output I²C...
  • Page 15: Table 4-1: Connector Description X1

    Hardware User Manual - CM-BF537 Last change: 26. March 2019/Version 10 Pin No. Signal Name Type Function N.C. BMODE1 I - 10k pull down Boot mode PF12 / MISO GPIO / SPI PF0 / DMAR0 / Tx0 GPIO / UART...
  • Page 16: Connector X2

    Hardware User Manual - CM-BF537 Last change: 26. March 2019/Version 10 4.2 Connector X2 Pin No. Signal Name Type Function Address Bus Address Bus Address Bus Address Bus Address Bus Address Bus Address Bus Address Bus Address Bus Address Bus...
  • Page 17: Table 4-2: Connector Description X2

    Hardware User Manual - CM-BF537 Last change: 26. March 2019/Version 10 Pin No. Signal Name Type Function RESET I – see chapter 5.2 Reset Memory Control Bus Memory Control Bus AMS2 Memory Control Bus VDD-RTC Backup battery supply Memory Control Bus...
  • Page 18: Application Information

    Hardware User Manual - CM-BF537 Last change: 26. March 2019/Version 10 5 Application Information 5.1 Supply Voltage Decoupling For a better stability we recommend to add a 100nF capacitor for each power supply pin and a 47uF tantalum capacitor to the V voltage rail next to the module.
  • Page 19: Application Example Schematics

    Hardware User Manual - CM-BF537 Last change: 26. March 2019/Version 10 5.3 Application Example Schematics 5.3.1 RJ45 schematic Figure 5-2: Schematic for RJ45 Connection Designator Value Type Description Quantity RJLBC-060TC1 RJ45 with magnetics R5, R6 220 Ω Resistor 0 Ω...
  • Page 20: Sample Schematic

    Hardware User Manual - CM-BF537 Last change: 26. March 2019/Version 10 5.4 Sample Schematic In this minimum configuration the CM-BF537 is used as a high-performance network connected processor module. Figure 5-3: Configuration with Ethernet and JTAG Connector Designator Value Type...
  • Page 21: Stand-Alone Ethernet Based Mpeg Webcam

    5.5 Stand-alone Ethernet based MPEG webcam The CM-BF537 module can be used as a stand-alone module for a camera system requiring only power supply and the direct attachment of a compatible video camera. An extender board including a camera is available at BECOM...
  • Page 22: Table 5-3: Bill Of Materials Of A Stand-Alone Ethernet Based Mpeg Webcam

    Hardware User Manual - CM-BF537 Last change: 26. March 2019/Version 10 Designator Value Type Description Quantity R1, R3, R6 Resistor R2, R4, R5 220R Resistor S1, S2 Push button ADP3338 Low dropout regulator XC6204B282MR-G XC6204 high speed LDO MIC5365-1.3YC5-TR MIC5365 LDO...
  • Page 23: Mechanical Outline

    6 Mechanical Outline 6.1 Top View shows the bottom view of the CM-BF537. All dimensions are given in millimeters. Take 0.5 mm as a Figure 6-1 tolerance for the boarder of the board since it is broken out from a multi-board panel and some additional boarder may remain.
  • Page 24: Bottom View

    Last change: 26. March 2019/Version 10 6.2 Bottom View Figure 6-2 shows the TOP VIEW of the bottom side components (through the Board View) of the CM-BF537 Core Module. All dimensions are given in millimeters. Figure 6-2: Mechanical outline and Bottom Connectors (Top View) 6.3 Side View...
  • Page 25: Footprint

    Figure 6-4: Recommended footprint for the Core Module (top view) The footprint of the CM-BF537 for Altium Designer is available on request. The used connectors can be found in Table 6-1. For detailed dimensions of the connectors please see the datasheet from the manufacturer’s website.
  • Page 26: Support

    Analog Devices Blackfin® embedded processors. This high-performance OS is based on the reliable and stable real-time VDK kernel from Analog Devices that comes with VDSP++ IDE. Of course, BLACKSheep® OS is fully supported by all BECOM Systems Core- Modules and development hardware.
  • Page 27: Ordering Information

    Table 8-1: Ordering information Note Custom Core Modules are available on request! Please contact BECOM Systems (office.systems@becom-group.com) if you are interested in custom Core Modules. The mount options of the Core Module CM-BF537 are shown in Table 8-2. Mount Option Flash Comment...
  • Page 28: Dependability

    Hardware User Manual - CM-BF537 Last change: 26. March 2019/Version 10 9 Dependability 9.1 MTBF Please keep in mind that a part stress analysis would be the only way to obtain significant failure rate results, because MTBF numbers just represent a statistical approximation of how long a set of devices should last before failure.
  • Page 29: Product History

    ADSP-BF537KBCZ-6AV (Rev 0.3) MT48LC16M16A2BG-75IT:D Flash PF48F3000P0ZBQE ETH-Phy KSZ8041 3.5.0 Processor ADSP-BF537KBCZ-6AV (Rev 0.3) MT48LC16M16A2B4-6A IT:G Flash IS29GL256-70DLEB ETH-Phy KSZ8041 Table 10-1: Overview CM-BF537-C-C-Q25S32F4 product changes 10.1.2 CM-BF537-C-I-Q25S32F4 (CM-BF537E-I) Version Component Type 3.0.1 Processor ADSP-BF537BBCZ-5A (Rev 0.2) MT48LC16M16A2BG-75IT:D Flash PF48F2000P0ZBQ0 ETH-Phy KSZ8041 3.0.2 Processor ADSP-BF537BBCZ-5A (Rev 0.3)
  • Page 30: Cm-Bf537-C-C-Q25S64F4 (Cm-Bf537E-64Sd)

    ADSP-BF537BBCZ-5A (Rev 0.3) MT48LC16M16A2BG-75IT:D Flash PF48F3000P0ZBQE ETH-Phy KSZ8041 3.5.0 Processor ADSP-BF537KBCZ-6AV (Rev 0.3) MT48LC16M16A2B4-6A IT:G Flash IS29GL256-70DLEB ETH-Phy KSZ8041 Table 10-2: Overview CM-BF537-C-I-Q25S32F4 product changes 10.1.3 CM-BF537-C-C-Q25S64F4 (CM-BF537E-64SD) Version Component Type 3.2.1 Processor ADSP-BF537KBCZ-6AV (Rev 0.3) IS42S16320B-7BL Flash PF48F3000P0ZBQE ETH-Phy KSZ8041 3.5.0 Processor ADSP-BF537KBCZ-6AV (Rev 0.3)
  • Page 31: Document Revision History

    2010-02-02 Redesign of Manual 2009-11-05 Picture 3-7, 6-1, 6-2, Table 6-1, 6-2 updated 2009-08-31 First release V1.0 of the document copied from CM-BF537 V1.2 and updated to Revision 3.0 Table 11-1: Revision history © BECOM Systems 2020 31 | 33...
  • Page 32: List Of Abbreviations

    Hardware User Manual - CM-BF537 Last change: 26. March 2019/Version 10 12 List of Abbreviations Abbreviation Description Analog Devices Inc. Analog Input Asynchronous Memory Select Analog Output Core Module Direct Current Digital Signal Processor Enhanced Core Module External Bus Interface...
  • Page 33: A List Of Figures And Tables

    Last change: 26. March 2019/Version 10 List of Figures and Tables Figures Figure 1-1: Main components of the CM-BF537 Core Module ............................6 Figure 2-1: Detailed block diagram........................................9 Figure 2-2: PF4 and PF5 routing ..........................................10 Figure 2-3: Assembly drawing top view ......................................11 Figure 5-1: Schematic of reset circuit on the Core Module ............................

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