Pad - Epson S1D16000 Series Technical Manual

S1D16501 Series

5. PAD

Pad layout
109
110
119
1
AL pad specifications (S1D16501D00A
a
c
www.DataSheet4U.com
Pad a Opening (X, Y)
Pad b Opening (X, Y)
Pad c Opening (X, Y)
3–4
Chip size: ........................... 13.43 mm × 1.76 mm
Chip thickness: ................... 400 µm (Typ.)
)
*
153µm (Min)
a a
c
(Min)
475µm
110 × 110µm
110 × 110µm
110 × 110µm
Y
X
Chip edge
152µm-α
b
170µm-α
b
Chip edge
PAD No 30 to 109
PAD No 20 to 29, 110 to 119
PAD No 1 to 19
EPSON
130µm
152µm-α
b
144µm
30
29
20
19
(Min)
Rev.1.0