Telit Wireless Solutions ME310G1 Series Hw Design Manual
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Telit Wireless Solutions ME310G1 Series Hw Design Manual

Telit Wireless Solutions ME310G1 Series Hw Design Manual

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ME310G1
HW Design Guide
1VV0301588 Rev. 10 – 2021-01-12
Telit Technical Documentation

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  • Page 1 ME310G1 HW Design Guide 1VV0301588 Rev. 10 – 2021-01-12 Telit Technical Documentation...

  • Page 2: Applicability Table

    ME310G1 Hardware Design Guide APPLICABILITY TABLE PRODUCTS ME310G1-W1 ME310G1-WW ME310G1-WWV ME310G1-W2 1VV0301588 Rev. 10 Page 2 of 88 2021-01-12...

  • Page 3: Table Of Contents

    ME310G1 Hardware Design Guide CONTENTS APPLICABILITY TABLE ................2 CONTENTS .................... 3 INTRODUCTION ..............8 Scope ..................8 Audience ..................8 Contact Information, Support ........... 8 Symbol Conventions ..............9 Related documents ..............9 GENERAL PRODUCT DESCRIPTION ........10 Overview .................. 10 Product Variants and Frequency Bands ........
  • Page 4 ME310G1 Hardware Design Guide LGA Pads Layout ..............22 POWER SUPPLY ..............23 Power Supply Requirements ..........23 Power Consumption..............24 Idle mode ................. 24 ME310G1-W1 Connected Mode ..........25 ME310G1-WW and ME310G1-WWV Connected Mode ... 26 ME310G1-W2 Connected Mode ..........27 General Design Rules .............
  • Page 5 ME310G1 Hardware Design Guide Serial Ports ................41 5.7.3.1. Asynchronous Serial Port (USIF0) .......... 41 5.7.3.2. Asynchronous Serial Port (USIF1) .......... 43 5.7.3.3. Auxiliary Serial Port ..............43 General purpose I/O ..............44 Using a GPIO as INPUT ............44 Using a GPIO as OUTPUT ............
  • Page 6 ME310G1 Hardware Design Guide MECHANICAL DESIGN ............55 Drawing ................... 55 ME310G1-W1 ................55 ME310G1-WW, ME310G1-WWV and ME310G1-W2 ....56 APPLICATION PCB DESIGN ..........57 Footprint .................. 57 ME310G1-W1 ................57 ME310G1-WW, ME310G1-WWV and ME310G1-W2 ....59 Recommendations for ME310G1-W1 ........61 Recommendations for ME310G1-WW, ME310G1-WWV and ME310G1-W2 ................
  • Page 7 ME310G1 Hardware Design Guide ISDE certificates ISED Certificate / ........73 Liste des règles FCC et Applicable FCC and ISED rules / ISDE applicables ..............73 FCC and ISED Regulatory notices / Avis réglementaires de FCC et ISDE ................74 FCC/ISDE Antennes FCC/ISED Antennas / ......

  • Page 8: Introduction

    ME310G1 Hardware Design Guide INTRODUCTION Scope This document introduces the ME310G1 module and presents possible and recommended hardware solutions for the development of a product based on this module. All the features and the solutions described in this document are applicable to all the variants listed in the applicability table.

  • Page 9: Symbol Conventions

    ME310G1 Hardware Design Guide Symbol Conventions Danger: This information MUST be followed or catastrophic equipment failure or personal injury may occur. Warning: Alerts the user on important steps about the module integration. Note/Tip: Provides advice and suggestions that may be useful when integrating the module.

  • Page 10: General Product Description

    ME310G1 Hardware Design Guide GENERAL PRODUCT DESCRIPTION Overview The ME310G1 module is a CATM / NBIoT communication product that allows integrators to plan availability for even the longest lifecycle applications, highly recommended for new designs specified for worldwide coverage. The ME310G1-WWV product is fully voice capable, the digital audio interface make it suitable for applications such as voice enabled alarm panels, mHealth patient monitors and specialty phones such as those for the elderly or sensory-impaired.

  • Page 11: Target Market

    ME310G1 Hardware Design Guide Target Market ME310G1 can be used for telematics applications where tamper-resistance, confidentiality, integrity, and authenticity of end-user information are required, for example: • Telematics services • Road pricing • Pay-as-you-drive insurance • Stolen vehicles tracking • Internet connectivity Main features Function Features...

  • Page 12: Me310G1-Ww And Me310G1-Wwv

    ME310G1 Hardware Design Guide ME310G1-WW and ME310G1-WWV RF power (dBm) Band Mode Class Nominal* 32.5 GPRS 850/900MHz EGPRS 29.5 GPRS 1800/1900MHz EGPRS B1, B2, B3, B4, B5, B8, B12, B13, B18, (LTE) CAT-M1 B19, B20, B25, B26, B27, B28, B66, B85 B1, B2, B3, B4, B5, B8, B12, B13, B18, (LTE) CAT-NB2 B19, B20, B25, B26, B28, B66, B85...
  • Page 13 ME310G1 Hardware Design Guide REFsens (dBm) REFsens (dBm)* Band Typical 3GPP Limit CAT M1 / Band5 -106.0 -100.8 CAT M1 / Band8 -107.3 -99.8 CAT M1 / Band12 -103.2 -99.3 CAT M1 / Band13 -104.3 -99.3 CAT M1 / Band18 -107.2 -102.3 CAT M1 / Band19...

  • Page 14: Me310G1-Ww

    ME310G1 Hardware Design Guide REFsens (dBm) REFsens (dBm)* Band Typical 3GPP Limit CAT NB2 / Band85 -115.7 Table 7: RX Sensitivity ME310G1-W1 * 3GPP TS 36.521-1 Release 15 Minimum performance requirement ME310G1-WW REFsens (dBm) REFsens (dBm)* Band Typical 3GPP Limit CATM1 / Band1 -105.6 -102.7...

  • Page 15: Me310G1-W2

    ME310G1 Hardware Design Guide REFsens (dBm) REFsens (dBm)* Band Typical 3GPP Limit CAT NB2 / Band12 -115.5 -108.2 CAT NB2 / Band13 -115.5 -108.2 CAT NB2 / Band18 -115.8 -108.2 CAT NB2 / Band19 -115.6 -108.2 CAT NB2 / Band20 -114.7 -108.2 CAT NB2 / Band25...

  • Page 16: Mechanical Specifications

    ME310G1 Hardware Design Guide Mechanical Specifications Dimensions The overall dimensions of ME310G1-W1 are: • Length: 14.3 mm • Width: 13.1 mm • Thickness: 2.6 mm The overall dimensions of ME310G1-WW, ME310G1-WWV and ME310G1-W2 are: • Length: 18.0 mm • Width: 15.0 mm •...

  • Page 17: Pins Allocation

    ME310G1 Hardware Design Guide PINS ALLOCATION Pin-out Signal Function Type Comment USB HS 2.0 Communication Port differential USB_D+ Data (+) differential USB_D- Data (-) USB_VBUS USB Power Sense Asynchronous Serial Port (USIF0) – Prog. / Data + HW Flow Control Serial data input Internal PU TXD0...
  • Page 18 ME310G1 Hardware Design Guide Signal Function Type Comment External SIM_CLK CMOS 1.8V signal – Clock External SIM_RST CMOS 1.8V signal – Reset External SIM_DAT CMOS 1.8V signal – Data I/O Power supply for Only 1.8V simcard SIM_VCC 1.8V the SIM are supported Presence SIMIN...
  • Page 19 ME310G1 Hardware Design Guide Signal Function Type Comment Digital To Analog PWM signal converter Output RF Section Main Antenna (50 CELL_MAIN ANTENNA ohm) GNSS ANTENNA GNSS Antenna GNSS_PPS GNSS external GNSS_LNA_EN CMOS 1.8V LNA enable GNSS_PPS 1 Pulse per Second CMOS 1.8V Miscellaneous Functions S_LED...
  • Page 20 ME310G1 Hardware Design Guide Signal Function Type Comment RF Ground Power RF Ground Power RF Ground Power RF Ground Power RF Ground Power RF Ground Power RF Ground Power RF Ground Power RF Ground Power RF Ground Power RF Ground Power RF Ground Power...
  • Page 21 ME310G1 Hardware Design Guide Signal Function Type Comment RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED...

  • Page 22: Lga Pads Layout

    ME310G1 Hardware Design Guide LGA Pads Layout TOP VIEW CELL MAIN S_LED DVI_W DVI_R DVI_T GNSS DVI_C GNSS_ 1PPS GNSS_ LNA_E SIM_C SIM_R SIM_D ON_OF CTANK SIM_V PWRM USB_V BOOT USB_D USB_D- VBATT SPI_C SPI_MI TX_AU C103/T C106/C C103/T C105/R SPI_M SPI_C RX_AU...

  • Page 23: Power Supply

    ME310G1 Hardware Design Guide POWER SUPPLY The power supply circuitry and the board layout are a very important part in the full product design and they strongly reflect on the overall performance of the product so the requirements and the guidelines that will follow should be read carefully for a proper design.

  • Page 24: Power Consumption

    ME310G1 Hardware Design Guide Note: The application’s power supply section must be designed with care to avoid an excessive voltage drop during transmission peak current absorptions. If the voltage drops beyond the limits of the Extended Operating Voltage range, an unintentional module power off can occur.

  • Page 25: Me310G1-W1 Connected Mode

    ME310G1 Hardware Design Guide Measure* Mode Mode Description (Typical) (mA) GPS+GLO, DPO off Acquisition 69.3 Active State GPS+GLO, DPO on DWELL=280ms (GNSS ON, CFUN=4) Navigation GPS+GLO, DPO off 55.9 GPS+GLO, DPO off Acquisition 68.5 Active State GPS+GLO, DPO on DWELL=280ms (GNSS ON, 15.7 Navigation...

  • Page 26: Me310G1-Ww And Me310G1-Wwv Connected Mode

    ME310G1 Hardware Design Guide ME310G1-WW and ME310G1-WWV Connected Mode Measure Mode (Typical) Description Average Peak Connected mode (mA) (mA) 1 RB, RMC, TBS=5, QPSK, 23dBm, 1100 Band 85, 28, 12 1 RB, RMC, TBS=5, QPSK,23dBm, CATM Band 13, 26, 5, 18, 19, 20, 8 1 RB, RMC, TBS=5, QPSK, 23dBm, Band 3, 2, 25, 4, 1, 66 3.75KHz...

  • Page 27: Me310G1-W2 Connected Mode

    ME310G1 Hardware Design Guide ME310G1-W2 Connected Mode Measure Mode Mode (Typical) Description Average Peak Connected mode (mA) (mA) 1 RB, RMC, TBS=5, QPSK, 21dBm, B1, B3, B8, B20, B28 CATM 1 RB, RMC, TBS=5, QPSK 26dBm, B31, B72 3.75KHz subcarrier spacing, 1 SC, RU 32ms, TBS=0, BPSK, 21dBm, B1, B3, B8, B20, B28 3.75KHz subcarrier spacing, 1 SC, RU 32ms, TBS=0, BPSK, 23dBm, B31, B72...

  • Page 28: Source Power Supply Design Guidelines

    ME310G1 Hardware Design Guide used. A switching power supply will not be suited due to the low drop out requirements. • When using a linear regulator, a proper heat sink shall be provided in order to dissipate the power generated. •...

  • Page 29: 4.3.1.3. Battery Source Power Supply Design Guidelines

    ME310G1 Hardware Design Guide • In any case the frequency and Switching design selection is related to the application to be developed since the switching frequency could also generate EMC interferences. • For car PB battery the input voltage can rise up to 15,8V and this should be kept in mind when choosing components: all components in the power supply must withstand this voltage.
  • Page 30 ME310G1 Hardware Design Guide • A protection diode should be inserted close to the power input, in order to save the ME310G1 from power polarity inversion. Otherwise the battery connector should be done in a way to avoid polarity inversions when connecting the battery. •...

  • Page 31: Thermal Design Guidelines

    ME310G1 Hardware Design Guide Thermal Design Guidelines Worst case as reference values for thermal design of ME310G1 are: • Average current consumption: 700 mA (LTE CAT M1 and NB1 modes) • Average current consumption: 700 mA (GPRS and EDGE modes) •...

  • Page 32: Rtc Supply

    ME310G1 Hardware Design Guide • A dedicated ground for the Switching regulator separated by the common ground plane is suggested. • The placement of the power supply on the board should be done in such a way to guarantee that the high current return paths in the ground plane are not overlapped to any noise sensitive circuitry as the microphone amplifier/buffer or earphone amplifier.
  • Page 33 ME310G1 Hardware Design Guide Item Typical Output voltage 1.35V 1.8V 1.8V Output current Table 17: Operating range characteristics of PWRMON signal Note: PWRMON during PSM period is LOW ( PSM has to be previously enabled by AT+CPSMS command) Note: The Output Current MUST never be exceeded; care must be taken when designing the application section to avoid an excessive current consumption.

  • Page 34: Digital Section

    ME310G1 Hardware Design Guide DIGITAL SECTION ME310G1 has four main operation states: • OFF state: Vbatt is applied and only RTC is running. The Baseband is switched OFF and the only possible change is the ON state. • ON state: the baseband is fully switched on and ME310G1 is ready to accept AT commands.

  • Page 35: Power On

    ME310G1 Hardware Design Guide Power On The following flow chart shows the proper “Modem Turn ON” procedure. “Modem ON Proc” START VBATT>VBATT PWRMON=ON ? ON_OFF* = LOW Delay = 5 sec ON_OFF*= HIGH PWRMON=ON ? Delay = 1 sec GO TO “Start AT Commands””...

  • Page 36: Power Off

    ME310G1 Hardware Design Guide In some use cases ON_OFF* can be tied fix LOW taking in account two limitations: 1. PSM wake-up asynchronous capability will be lost. 2. To perform an unconditional shutdown it is necessary to send AT#SYSHALT command and then cut Vbatt. Power Off The proper procedure to power-off the module is to use the AT#SHDN command.

  • Page 37: Unconditional Shutdown

    ME310G1 Hardware Design Guide Unconditional shutdown The following flow chart shows the proper procedure for unconditional shutdown of ME310G1 except in PSM mode. When the procedure is completed the ME310G1 is reset and it stops any operation. After the release of the line, the ME310G1 is unconditionally shut down, without performing any detach operation from the network in which it is registered.

  • Page 38: Wake Up From Deep Sleep Mode

    ME310G1 Hardware Design Guide Warning: Unconditional Hardware SHUTDOWN by toggling VBATT Power, must not be used during the normal shutdown operation of the device since it does not detach the device from the network and can damage the memory content. It shall be kept as an emergency exit procedure.

  • Page 39: Fast Shut Down By Hardware

    ME310G1 Hardware Design Guide Fast shut down by hardware The Fast Power Down can be triggered by configuration of any GPIO. HI level to LOW level transition of GPIO triggers fast power down procedure. Example circuit: Note: Consider voltage drop under max current conditions when defining the voltage detector thereshold in order to avoid unwanted shutdown.

  • Page 40: Communication Ports

    ME310G1 Hardware Design Guide Communication ports USB 2.0 HS The ME310G1 includes one integrated universal serial bus (USB 2.0 HS) transceiver. The following table lists the available signals: Signal Function NOTE USB_D+ USB differential Data (+) USB_D- USB differential Data (-) VUSB Power sense for the internal USB transceiver.

  • Page 41: Serial Ports

    ME310G1 Hardware Design Guide Signal Function Type NOTE SPI_CS SPI Chip Select CMOS 1.8V Table 23: Available signals Note: The SPI interface is supported through the Telit AppZone APIs. Serial Ports The ME310G1 module is provided by 3 Asynchronous serial ports: •...
  • Page 42 ME310G1 Hardware Design Guide RS232 Pin Signal Name Usage Input to the ME310G1 Data Terminal that controls the DTE Ready READY condition A3, A7, A9, A13, A17, B4, B6, B10, B12, B14, B16, C19, D18, F8, F12, F18, G19, Ground Ground H6, H14, J19, K18, M18, N19, P6, P14, T8, T12, U1, V2, W19, Y2, Y4...

  • Page 43: Asynchronous Serial Port (Usif1)

    ME310G1 Hardware Design Guide 5.7.3.2. Asynchronous Serial Port (USIF1) The serial port 1 on the ME310G1 is a +1.8V UART with 5 RS232 signals. It differs from the PC-RS232 in the signal polarity (RS232 is reversed) and levels. Warning: C104/RXD1 cannot have any PU or HIGH state during BOOTING UP phase.

  • Page 44: General Purpose I/O

    ME310G1 Hardware Design Guide General purpose I/O The ME310G1 module is provided by a set of Configurable Digital Input / Output pins (CMOS 1.8V). Input pads can only be read; they report the digital value (high or low) present on the pad at the read time of. The Output pads can only be written or queried and set the value of the pad output.

  • Page 45: External Sim Holder

    ME310G1 Hardware Design Guide External SIM Holder Please refer to the related User Guide (SIM Holder Design Guides, 80000NT10001a). Note: There is no dedicated signal (SIMIN) for “Presence SIM” in the ME310G1 pinout. This feature can performed by connecting GPIO_01 (Pad V11) or of GPIO_02 (Pad V13) or of GPIO_03 (Pad D7) or of GPIO_04 (Pad D9) to the switch embedded in the sim-holder.

  • Page 46: Using Adc Converter

    ME310G1 Hardware Design Guide Item Typical Unit Input Voltage range Volt AD conversion bits Table 28 ADC Characteristics Using ADC Converter Available in a next document revision. DAC Converter The ME310G1 provides a Digital to Analog Converter. The signal (named DAC) is available on pin R16 of the ME310G1.

  • Page 47: Rf Section

    ME310G1 Hardware Design Guide RF SECTION Antenna requirements The antenna connection and board layout design are the most important aspect in the full product design as they strongly affect the general performance of the product, so read carefully and follow the requirements and the guidelines for a proper design. The antenna and antenna transmission line on PCB for a Telit ME310G1 device shall fulfil the following requirements: Item...

  • Page 48: Pcb Design Guidelines

    ME310G1 Hardware Design Guide PCB Design guidelines When using the ME310G1, since there's no antenna connector on the module, the antenna must be connected to the ME310G1 antenna pad by means of a transmission line implemented on the PCB. This transmission line shall fulfil the following requirements: Item Value Characteristic Impedance...
  • Page 49 ME310G1 Hardware Design Guide • if EM noisy devices (such as fast switching ICs, LCD and so on) are present on the PCB hosting the ME310G1, take care of the shielding of the antenna line by burying it in an inner layer of PCB and surrounding it with the Ground planes, or shield it with a metal frame cover;...

  • Page 50: Audio Section

    ME310G1 Hardware Design Guide AUDIO SECTION The Telit digital audio interface (DVI) of the ME310G1 Module is based on the I S serial bus interface standard. The audio port can be connected to the end device through the digital interface, or through one of the several compliant codecs (in case an analog audio is needed).

  • Page 51: Gnss Section

    ME310G1 Hardware Design Guide GNSS SECTION The ME310G1 module includes a state-of-the-art receiver capable of simultaneously searching and tracking satellite signals from multiple satellite constellations. This multi- GNSS receiver uses the entire spectrum of GNSS systems available: GPS, GLONASS, BeiDou, Galileo, and QZSS. GNSS Signals Pin-out Signal Function...

  • Page 52: Hardware-Based Solution For Gnss And Lte Coexistence

    ME310G1 Hardware Design Guide • Place EM noisy devices as far as possible from antenna line. • Keep the antenna line away from power supply lines. • Keep the antenna line away from GSM RF lines. • If there are noisy EM devices around the PCB hosting the module, such as fast switching ICs, take care of the shielding of the antenna line by burying it inside the layers of the PCB and surrounding it with the Ground planes, or shielding it with a metal frame cover.

  • Page 53: Gnss Antenna Requirements

    ME310G1 Hardware Design Guide GNSS Antenna Requirements GNSS active antenna must be used or integrated in the application. GNSS Antenna specification Item Value Frequency range 1559.0 ~ 1610.0 MHz Gain 15 ~ 30dB Impedance 50 ohm Noise Figure of LNA <...

  • Page 54: Gnss Characteristics

    ME310G1 Hardware Design Guide The electrical characteristics of the GPS_LNA_EN signal are: Level Output High Level 1.6V 1.9V Output Low Level 0.3V Table 34: GPS_LNA_EN signal characteristics Example of external antenna bias circuitry: Figure 10: Antenna bias circuitry example Pay attention to the maximum bias current in case of unwanted short circuit on the antenna cable since the decoupling inductor can be damaged.

  • Page 55: Mechanical Design

    ME310G1 Hardware Design Guide MECHANICAL DESIGN Drawing ME310G1-W1 Figure Mechanical Drawing ME310G1-W1 Note: Dimensions in mm. General Tolerance ±0.1, Angular Tolerance ±1°, The tolerance is not cumulative. 1VV0301588 Rev. 10 Page 55 of 88 2021-01-12...

  • Page 56: Me310G1-Ww, Me310G1-Wwv And Me310G1-W2

    ME310G1 Hardware Design Guide ME310G1-WW, ME310G1-WWV and ME310G1-W2 Figure 12: Mechanical Drawing ME310G1-WW, ME310G1-WWV and ME310G1-W2 1VV0301588 Rev. 10 Page 56 of 88 2021-01-12...

  • Page 57: Application Pcb Design

    ME310G1 Hardware Design Guide APPLICATION PCB DESIGN The ME310G1 modules have been designed in order to be compliant with a standard lead- free SMT process. Footprint ME310G1-W1 COPPER PATTERN (top view) Figure 13: Copper Pattern (top view) 1VV0301588 Rev. 10 Page 57 of 88 2021-01-12...
  • Page 58 ME310G1 Hardware Design Guide SOLDER RESIST PATTERN (top view) Figure 14: Solder resist pattern (top view) 1VV0301588 Rev. 10 Page 58 of 88 2021-01-12...

  • Page 59: Me310G1-Ww, Me310G1-Wwv And Me310G1-W2

    ME310G1 Hardware Design Guide ME310G1-WW, ME310G1-WWV and ME310G1-W2 COPPER PATTERN (top view) Figure 15: Example Figure 1VV0301588 Rev. 10 Page 59 of 88 2021-01-12...
  • Page 60 ME310G1 Hardware Design Guide SOLDER RESIST PATTERN (top view) Figure 16: Example Figure 1VV0301588 Rev. 10 Page 60 of 88 2021-01-12...

  • Page 61: Recommendations For Me310G1-W1

    ME310G1 Hardware Design Guide Recommendations for ME310G1-W1 In order to easily rework the ME310G1-W1, it is recommended to consider on the application a 2 mm placement inhibit area around the module. It is also suggested, as a common rule for an SMT component, to avoid having a mechanical part of the application in direct contact with the module.

  • Page 62: Recommendations For Me310G1-Ww, Me310G1-Wwv And Me310G1-W2

    ME310G1 Hardware Design Guide Recommendations ME310G1-WW, ME310G1-WWV ME310G1-W2 In order to easily rework the ME310G1-WW, ME310G1-WWV and ME310G1-W2 it is recommended to consider the application placement inhibit area around the module, as specified in the below figure. It is also suggested, as common rule for an SMT component, to avoid having a mechanical part of the application in direct contact with the module.

  • Page 63: Pcb Pad Design

    ME310G1 Hardware Design Guide PCB pad design Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB. Copper Solder Mask NSMD (Soler Mask Defined) (Non Solder Mask Defined) Figure 19: PCB solder pad recommendations The recommendation for the PCB pads dimensions are 1:1 with module pads. It is not recommended to place via or micro-via not covered by solder resist in an area of 0.3 mm around the pads unless it carries the same signal of the pad itself Holes in pad are allowed only for blind holes and not for through holes.

  • Page 64: Stencil

    ME310G1 Hardware Design Guide Stencil The layout of the stencil apertures can be the same as the recommended footprint (1:1), we suggest a thickness of stencil foil ≥ 120 µm. Solder paste Item Lead Free Solder Paste Sn/Ag/Cu Table 37: Solder paste We recommend using only “no clean”...
  • Page 65 ME310G1 Hardware Design Guide Profile Feature Pb-Free Assembly Average ramp-up rate (T to T 3°C/second max Preheat 150°C – Temperature Min (Tsmin) 200°C – Temperature Max (Tsmax) 60-180 seconds – Time (min to max) (ts) Tsmax to TL 3°C/second max –...

  • Page 66: Packaging

    ME310G1 Hardware Design Guide PACKAGING Tray ME310G1-W1 Figure 21: ME310G1-W1 tray packaging 1VV0301588 Rev. 10 Page 66 of 88 2021-01-12...
  • Page 67 ME310G1 Hardware Design Guide Figure 22: ME310G1-W1 tray 1VV0301588 Rev. 10 Page 67 of 88 2021-01-12...

  • Page 68: Me310G1-Ww

    ME310G1 Hardware Design Guide ME310G1-WW Figure 23: ME310G1-WW tray packaging 1VV0301588 Rev. 10 Page 68 of 88 2021-01-12...
  • Page 69 ME310G1 Hardware Design Guide Figure 24: ME310G1-WW tray 1VV0301588 Rev. 10 Page 69 of 88 2021-01-12...

  • Page 70: Reel

    ME310G1 Hardware Design Guide Reel ME310G1-W1 1VV0301588 Rev. 10 Page 70 of 88 2021-01-12...

  • Page 71: Me310G1-Ww And Me310G1-W2

    ME310G1 Hardware Design Guide ME310G1-WW and ME310G1-W2 1VV0301588 Rev. 10 Page 71 of 88 2021-01-12...

  • Page 72: Conformity Assessment Issues

    ME310G1 Hardware Design Guide CONFORMITY ASSESSMENT ISSUES Approvals summary Type Approval ME310G1-W1 ME310G1-WW ME310G1-WWV ME310G1-W2 EU RED US FCC CA ISED BRAZIL ANATEL JAPAN JRF & JTBL CHINA CCC Ongoing Singapore INDA In planning Table 39: Type approvals summary RED approval RED Declaration of Conformity Hereby, Telit Communications S.p.A declares that the ME310G1-W1, ME310G1-WW, ME310G1-WWV and ME310G1-W2 Modules are in compliance with Directive 2014/53/EU.

  • Page 73: Fcc And Ised Approval / Fcc Et Isde Approbation

    ME310G1 Hardware Design Guide Max Gain for RED (dBi) Band ME310G1-W1 ME310G1-WW ME310G1-WWV ME310G1-W2 GSM 900 8.48 DCS 1800 14.36 GPRS/EGPRS 5.97 5.97 GPRS/EGPRS 10.34 9.34 1800 FDD 1 14.84 11.84 11.84 14.3 FDD 3 14.33 11.33 11.33 13.8 FDD 8 11.45 8.45 8.45...

  • Page 74: Fcc And Ised Regulatory Notices / Avis Réglementaires De Fcc Et Isde

    ME310G1 Hardware Design Guide Model Applicable ISED Rules Applicable FCC Rules Modèle Règles ISDE applicables ME310G1-WW Part 2, 22, 24, 27, 90 RSS: 132 Issue3, 133 Issue 6, 130 Issue 2, 139 Issue 3; ME310G1-WWV RSS-Gen Issue 5 Table 42 Applicable FCC and ISED rules FCC and ISED Regulatory notices / Avis réglementaires de FCC et ISDE Déclaration de modification...

  • Page 75: Fcc/Ised Antennas / Fcc/Isde Antennes

    ME310G1 Hardware Design Guide autre antenne ou autre émetteur. L'antenne doit être installée de façon à garder une distance minimale de 20 centimètres entre la source de rayonnements et votre corps. FCC Class B digital device notice (FCC only) This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.
  • Page 76 ME310G1 Hardware Design Guide Max Gain for FCC (dBi) Band ME310G1-W1 ME310G1-WW ME310G1-WWV GSM 850 GSM 1900 GPRS/EGPRS 850 GPRS/EGPRS 1900 FDD 2 11.0 FDD 4 FDD 5 12.4 FDD 12 11.6 FDD 13 12.1 FDD 25 11.0 FDD 26 12.3 FDD 66 FDD 71...

  • Page 77: Fcc Label And Compliance Information

    ME310G1 Hardware Design Guide Gain maximum pour ISDE (dBi) Gain maximum for ISED (dBi) / Bande ME310G1-W1 ME310G1-WW ME310G1-WWV GSM 850 GSM 1900 GPRS/EGPRS 850 GPRS/EGPRS 1900 FDD 2 11.0 FDD 4 FDD 5 FDD 12 FDD 13 FDD 25 11.0 FDD 26 FDD 66...

  • Page 78: Ised Label And Compliance Information/Étiquette Et Informations De Conformité Isde

    ME310G1 Hardware Design Guide Étiquette et informations de ISED label and compliance information/ conformité ISDE The host product shall be properly labelled to identify the modules within the host product. The ISED certification label of a module shall be clearly visible at all times when installed in the host product;...

  • Page 79: Fcc Additional Testing, Part 15 Subpart B Disclaimer

    ME310G1 Hardware Design Guide If this module is intended for use in a portable device, the user is responsible for separate approval to meet the SAR requirements of FCC Part 2.1093 and IC RSS-102. Le module a été évalué dans des conditions autonomes mobiles. Pour différentes conditions de fonctionnement d'un émetteur modulaire autonome dans un hôte (plusieurs modules émettant simultanément ou d'autres émetteurs dans un hôte), des tests supplémentaires peuvent être nécessaires (colocalisation, retesting…)

  • Page 80: Product And Safety Information

    ME310G1 Hardware Design Guide PRODUCT AND SAFETY INFORMATION Copyrights and Other Notices SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE Although reasonable efforts have been made to ensure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from the use of the information contained herein.

  • Page 81: Usage And Disclosure Restrictions

    ME310G1 Hardware Design Guide including – but not limited to - the exclusive right to copy or reproduce in any form the copyrighted products. Accordingly, any copyrighted computer programs contained in Telit’s products described in this instruction manual shall not be copied (reverse engineered) or reproduced in any manner without the express written permission of the copyright owner, being Telit or the 3rd Party software supplier.

  • Page 82: Trademarks

    ME310G1 Hardware Design Guide Trademarks TELIT and the Stylized T-Logo are registered in the Trademark Office. All other product or service names are property of their respective owners. 3rd Party Rights The software may include 3rd Party’s software Rights. In this case the user agrees to comply with all terms and conditions imposed in respect of such separate software rights.

  • Page 83: Safety Recommendations

    ME310G1 Hardware Design Guide Safety Recommendations Make sure the use of this product is allowed in your country and in the environment required. The use of this product may be dangerous and has to be avoided in areas where: • it can interfere with other electronic devices, particularly in environments such as hospitals, airports, aircrafts, etc.

  • Page 84: Glossary

    ME310G1 Hardware Design Guide GLOSSARY Analog – Digital Converter BPSK Modulation used for in OFDM symbols Clock CMOS Complementary Metal – Oxide Semiconductor Chip Select Digital – Analog Converter Data Terminal Equipment Digital Voice Interface Electromagnetic Electromagnetic Compatibility Electromagnetic Interference Equivalent Series Resistance Frequency Division Duplexing GPIO...
  • Page 85 ME310G1 Hardware Design Guide Resource Block; the smallest unit of resources that can be allocated to a user Radio Frequency Reference Measurement Channel; it refers to a 3GPP standardized setting for the channel. For more details, refer to 3GPP TS 36.521-1 Real Time Clock Resource Unit (NB IoT Only);...

  • Page 86: Document History

    ME310G1 Hardware Design Guide DOCUMENT HISTORY Revision Date Changes 2021-01-12 Reviewed template design and styles Section 12.2 updated with ME310G1-W2 information Section 11.2 updated with Reel information Section 7.2 removed Chapter 4 update 2020-09-14 Added ME310G1-W2 variant Section 2.5, TX Power update Section 2.8, Temperature ranges update Section 5.2, Power-on timing change back to 5sec 2020-07-22...
  • Page 87 ME310G1 Hardware Design Guide Revision Date Changes 2019-06-13 Band list update, pinout update Added SIMIN, USB_VBUS, CTANK, PWRMON, ROM_BOOT pins description Added power on procedure 2019-03-11 First issue 1VV0301588 Rev. 10 Page 87 of 88 2021-01-12...

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