PAN9520 Wi-Fi Module
A critical point is the transition from the module to the mother PCB. Further simulations of the
transition and the RF paths help to determine e.g. the positions of ground vias around the RF
pad.
Dimensions of the used RF path:
•
Trace width
•
Gap to GND
•
Copper thickness
•
Height of substrate
•
Relative permittivity
•
Loss tangent
Module Integration Guide Rev. 1.1
W
= 178 µm
G
= 156 µm
TH
= 35 µm
H
= 127 µm
ε
= 4.2
r
tan δ
= 0.021
G
ε
, tan δ
r
G
W
5 RF Path
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