Huawei MU509 Manual page 6

PCB Design
CB Pad Design
To achieve high efficiency of the production and solder joints of high reliability, it
is recommended that the PCB pad size be designed as follows: the size of the
middle region is the same as the pad size of the product package; other pads are
0.05 mm larger than the unilateral pad of the product package. For details, see
the following figure:
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